Proceedings ArticleDOI
Demonstrating reliability and reliability growth with environmental stress screening data
K.L. Wong
- pp 47-52
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TLDR
Problems with conventional reliability demonstration methods are addressed, and the conventional reliability-demonstration tests are compared with the environmental stress screening (ESS) method and the concept of the roller-coaster curve is reviewed.Abstract:
Problems with conventional reliability demonstration methods are addressed, and the conventional reliability-demonstration tests are compared with the environmental stress screening (ESS) method. The concept of the roller-coaster curve is reviewed. The aging process for electronics and the relative benefits of ESS and the roller-coaster curve are explored. Recommendations on implementing ESS for reliability demonstration and reliability assurance are provided. >read more
Citations
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References
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Proceedings ArticleDOI
Off the bathtub onto the roller-coaster curve (electronic equipment failure)
K.L. Wong,D.L. Lindstrom +1 more
TL;DR: In this paper, the shape of the hazard rate curve for a semiconducting device is studied by the authors, who show that the flaws would emerge as failures that give a decreasing failure rate.
Off The Bathtub onto The Roller-Coaster Curve
TL;DR: In this paper, the authors further explored the shape of the hazard rate curve and showed that failure humps along the way on the curve came from failures of small flaws left over from major flaw groups due to limitations in inspection and test.
Journal ArticleDOI
The effectiveness of satellite environmental acceptance tests.
Otto Hamberg,William F. Tosney +1 more
TL;DR: In this article, the effectiveness of system level environmental tests conducted on satellites in reducing failures that could occur in early flight, and relates the flight failures potentially avoided to the types of test and the time expended.
Journal ArticleDOI
Influence of quality of manufacture on electronic equipment and system reliability
Urs Ender,Wolfgang Gerling +1 more
TL;DR: In this article, it has been shown that an improvement of manufacturing quality by a factor of 5 has increased system reliability by about the same degree as an improvement in manufacturing quality of printed circuit board assemblies.