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Journal ArticleDOI

Effects of Pin Shape and Array Orientation on Heat Transfer and Pressure Loss in Pin Fin Arrays

TLDR
In this paper, two families of pin fin array geometries which have potential for improving airfoil internal cooling performance were studied experimentally and the results indicated that the use of circular pins with array orientation between staggered and inline can increase heat transfer while decreasing pressure loss.
Abstract
Modern high-performance gas turbine engines operate at high turbine inlet temperatures and require internal convection cooling of many of the components exposed to the hot gas flow. Cooling air is supplied from the engine compressor at a cost to cycle performance and a design goal is to provide necessary cooling with the minimum required cooling air flow. In conjunction with this objective, two families of pin fin array geometries which have potential for improving airfoil internal cooling performance were studied experimentally. One family utilizes pins of a circular cross section with various orientations of the array with respect to the mean flow direction. The second family utilizes pins with an oblong cross section with various pin orientations with respect to the mean flow direction. Both heat transfer and pressure loss characteristics are presented. The results indicate that the use of circular pins with array orientation between staggered and inline can in some cases increase heat transfer while decreasing pressure loss. The use of elongated pins increases heat transfer, but at a high cost of increased pressure loss. In conjunction with the present measurements, previously published results were reexamined in order to estimate the magnitude of heat transfer coefficients on the pin surfaces relative to those of the endwall surfaces. The estimate indicates that the pin surface coefficients are approximately double the endwall values.

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Journal ArticleDOI

The utilization of selective laser melting technology on heat transfer devices for thermal energy conversion applications: A review

TL;DR: The aim of this research is to review the advancement in design complexities of different industrial heat transfer devices incorporating metal SLM fabrication, and presents the opportunities and challenges related to the application of SLM technology in connection to novel HXs and HSs, as well as heat pipes (HPs).
Journal ArticleDOI

Performance comparison of pin fin in-duct flow arrays with various pin cross-sections.

TL;DR: In this article, the heat transfer and pressure drop characteristics of pin fin arrays were investigated in terms of appropriate dimensionless variables and the final judgment of the performance of the pin fin cross-section was performed based on the heat exchanger performance plot.
Proceedings ArticleDOI

Heat Transfer Contributions of Pins and Endwall in Pin-Fin Arrays: Effects of Thermal Boundary Condition Modeling

TL;DR: In this article, a mass transfer analogy based on the naphthalene sublimation technique was used to reveal the individual heat transfer contributions from pins and endwalls with the entire wetted surface thermally active.
Journal ArticleDOI

Modeling of the thermal and hydraulic performance of plate fin, strip fin, and pin fin heat sinks-influence of flow bypass

TL;DR: In this paper, a wind tunnel test with seven types of heat sinks including plate fin, strip fin, and pin fin heat sinks was conducted in order to evaluate the Nusselt number and dimensionless pressure drop.
Journal ArticleDOI

Pressure drop and heat transfer of square pin-fin arrays in in-line and staggered arrangements

TL;DR: In this paper, the authors used transient single blow technique to study the pressure drop and heat transfer of a square pin-fin array in a rectangular channel by using the transient single-blow technique.
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