Patent
Electronics cooling assembly with multi-position, airflow-blocking mechanism
TLDR
In this paper, an air-cooled heat sink, an auxiliary air-moving device, and an airflow blocking mechanism are used to dissipate heat from the electronic component(s) to a cooling airflow passing across the heat sink.Abstract:
Electronics cooling assemblies are provided which include an air-cooled heat sink, an auxiliary air-moving device, and an airflow-blocking mechanism. The heat sink couples to one or more heat-generating electronic components, and dissipates heat from the electronic component(s) to a cooling airflow passing across the heat sink. The auxiliary air-moving device provides, when active, an increased flow rate of the cooling airflow across the heat sink. The airflow-blocking mechanism toggles between a passive airflow position and an active airflow position. In the passive airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the heat sink without passing through the air-moving device, and in the active airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the auxiliary air-moving device.read more
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Patent
Server system having a hot plug motherboard
Cheng Cheng-Lung,Chen Ching-Tung +1 more
TL;DR: In this article, a server system with a hot-plugged motherboard is described, which includes a motherboard module, at least one midplane board and a hard disk module, coupled by hot plugging to each of the motherboards.
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Patent
Method and system for cooling electronics racks using pre-cooled air
TL;DR: In this paper, a cooling fluid is supplied to the inlet heat exchanger, to cool incoming air below ambient temperature, and the exhaust heat exchangers further transfers heat dissipated by electronic devices to the cooling fluid.
Patent
Contact cooled electronic enclosure
TL;DR: In this article, the authors present a system and an associated method to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure, which comprises a cold plate that is mounted on the electronic enclosure to conduct heat thermally.
Patent
System for airflow management in electronic enclosures
TL;DR: In this paper, a dual-blower assembly includes a single blower housing with a front and a rear blower, each of which is configured to force air in a direction from the front blower to the rear.
Patent
Computer system cooling configuration
Kenneth Kitlas,Anita Patel,Satyanarayana Nishtala,Alan Lee Winick,Alan Lam,Winiie C. Leung,Kenneth A. Lown,Mohammed Tantoush +7 more
TL;DR: In this paper, a computer system housing where a vertical printed circuit board (e.g., a riser card) is inserted into a socket on the computer system motherboard is described.
Patent
Dense packaging and cooling system for use with a server or other processor-based device
TL;DR: In this article, a server is divided into two different cooling zones, a first pressure zone and a second pressure zone, and a high output fan directs air across tightly packaged, heat producing components disposed in the higher pressure zone.