Patent
Hermetic plastic dual-in-line package for a semiconductor integrated circuit
TLDR
In this paper, a chip carrier with a plurality of conducting fingers that terminate at its underside is described, and a lid is placed over the carrier and the chip is hermetically sealed inside the cavity of the carrier.Abstract:
A hermetic plastic package for a semiconductor integrated circuit chip includes a chip carrier provided with a plurality of conducting fingers that terminate at its underside. The carrier includes a pedestal onto which a semiconductor chip is bonded and wires are connected between the bonding pads on the chip and associated fingers on the carrier. A lid is placed over the carrier and is hermetically sealed with the chip inside the cavity of the carrier. The finger terminations on the underside of the carrier are connected to a plurality of leads which have inner portions that extend outward in a direction parallel to the underside of the carrier and end portions that are bent substantially perpendicular to the underside of the carrier configuration. The chip carrier and the inner portions of the leads that lie parallel to the underside of the chip carrier are encased in a plastic or epoxy compound.read more
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Patent
Transparent contacts for organic devices
TL;DR: In this paper, a multicolor organic light emitting device employs vertically stacked layers of double heterostructure devices which are fabricated from organic compounds, and the devices are configured as stacked to provide a staircase profile whereby each device is separated from the other by a thin transparent conductive contact layer to enable light emanating from each of the devices to pass through the semitransparent contacts and through the lower device structures.
Patent
Multicolor organic light emitting devices
TL;DR: In this paper, a multicolor organic light emitting device employs vertically stacked layers of double heterostructure devices which are fabricated from organic compounds, and the devices are configured as stacked to provide a staircase profile whereby each device is separated from the other by a thin transparent conductive contact layer to enable light emanating from each of the devices to pass through the semitransparent contacts and through the lower device structures while further enabling each device to receive a selective bias.
Patent
Method of fabricating transparent contacts for organic devices
TL;DR: In this paper, a multicolor organic light emitting device employs vertically stacked layers of double heterostructure devices which are fabricated from organic compounds, and the devices are configured as stacked to provide a staircase profile whereby each device is separated from the other by a thin transparent conductive contact layer to enable light emanating from each of the devices to pass through the semitransparent contacts and through the lower device structures.
Patent
Organic light emitting devices
Stephen R. Forrest,Mark E. Thompson,Paul E. Burrows,Linda S. Sapochak,Dennis Matthew McCarty +4 more
TL;DR: In this article, a multicolor organic light emitting device employs vertically stacked layers of double heterostructure devices which are fabricated from organic compounds, and the devices are configured as stacked to provide a staircase profile whereby each device is separated from the other by a thin transparent conductive contact layer to enable light emanating from each of the devices to pass through the semitransparent contacts and through the lower device structures while further enabling each device to receive a selective bias.
Patent
Mixed vapor deposited films for electroluminescent devices
Stephen R. Forrest,Mark E. Thompson,Paul E. Burrows,Linda S. Sapochak,Dennis M. Mccarty,Jon A. Cronin +5 more
TL;DR: A light emitting device (LED) structure and device containing the same in which the LED structure contains a plurality of at least a first (60M') and a second (60m'') light emitting organic devices (LEDs) stacked one upon the other, to form a layered structure, with each LED separated one from the other by a transparent conductive layer (120, 122) to enable each device to receive a separate bias potential to operate to emit light through the stack, at least one of said LED's comprising an emission layer containing an emitting compound, optionally in a
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Patent
Semiconductor device packaging
TL;DR: An improved semiconductor device package and process of manufacture incorporating an inner rigid glass structure including mounting pad and lead fingers and a surrounding plastic package through which leads extend is described in this article.
Patent
Multilayer ceramic multi-chip, dual in-line packaging assembly
TL;DR: In this paper, a multilayer ceramic, multi-chip, dual in-line packaging assembly comprises a ceramic substrate with a pair of semiconductor chip receiving cavities therein, and a lid is bonded to the top surface of the substrate to hermetically seal chips within the chip receiving cavity, thereby completing assembly of the package.
Patent
Electronic circuit package and method for making same
TL;DR: In this article, a multilayered electronic circuit package is disclosed containing a cavity for the mounting of one or more electronic devices such as semiconductor chips, and a metallized lead pattern at the interface of two adjacent layers of the body extends from the top surface portion of the underlying layer within the cavity to the overhanging underlying surface of the overlying layer of the cavity.
Patent
Enclosure for incapsulating electronic components
Wilbur T Wakely,Michael T. Leeds +1 more
TL;DR: An enclosure for encapsulating an electronic component including a substrate and a conductive lead frame attached to the substrate and embedded in a composite glass layer, the layer having two portions.