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Illumination system for ocr of indicia on a substrate

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TLDR
In this article, an illumination system (10, 40, 74, 100) is provided having one or more light sources (24, 26), opaque baffles (30, 32), and mirrors (50, 64, 66) for illuminating indicia on a substrate, such as a semiconductor wafer, for viewing by a camera.
Abstract
An illumination system (10, 40, 74, 100) is provided having one or more light sources (24, 26), opaque baffles (30, 32), and mirrors (50, 64, 66) for illuminating indicia on a substrate, such as a semiconductor wafer (18), for viewing by a camera (12, 42) aligned parallel to or at an angle (14) to the substrate. The light sources (24, 26) include light emitting diodes for illuminating soft marks and broad spectrum incandescent lamps for illuminating hard marks. Dark field and light field illuminators are provided for enhanced reading of light indicia on a dark background and dark indicia on a light background, respectively. A light control unit (158) allows for manual or automated control of light source selection and light intensity. Opposing mirrors extending along the optical paths of the light sources reflect light emitted from the light sources into the camera's field of view, thereby increasing the illumination efficiency and permitting the use of fewer light sources.

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Citations
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High throughput brightfield/darkfield wafer inspection system using advanced optical techniques

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References
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Patent

Apparatus for projecting a series of images onto dies of a semiconductor wafer.

TL;DR: In this article, an apparatus for forming on a semiconductor wafer unit magnification images of a reticle pattern is presented. But it is not shown how to construct the reticle patterns on the wafer.
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Laser processing apparatus

TL;DR: In this article, the authors present a laser processing apparatus for projecting a spot of laser beam onto a portion of a microcircuit pattern on a semiconductor wafer, photographic mask or the like to cut the lead or anneal the limited area.
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Calibrating laser trimming apparatus

TL;DR: In this article, a laser trimming apparatus calibration system including a laser beam positioning mechanism, imprinting a mark on a medium to establish an actual laser position, comparing the imprinted mark with the desired nominal position and producing a result indicative of the difference between the actual position and the nominal position is presented.
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Method of and apparatus for modulating a laser beam

TL;DR: In this paper, a laser system operating in both a lead bonding mode and a lead severing mode was presented, where the Q-switch was switched at a rate high enough to generate laser pulses suitable for severing the leads without heating adjacent portions of the leads.
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Light beam positioning system

TL;DR: In this paper, an error correction processor is used to compensate X and Y position coordinate signals (X and Y signals) produced by a conventional position data generator for delivery to a light beam positioner, which allows the use of a single command data file in the system control computer, which is capable of controlling different systems of the same model type.
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