Patent
Integrated circuit device and manufacturing method thereof
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TLDR
In this paper, an integrated circuit element (12) is mounted on one surface of the thin metal plates having the other surface which at least part serves as a plurality of external connecting terminals.Abstract:
Provided is an integrated circuit device is used in an IC card or the like, and a manufacturing method of the integrated circuit device, having a thin thickness so as to be capable of being manufactured highly accurately in dimensions and highly efficiently. The integrated circuit element (12) is mounted on one surface of the thin metal plates (11) having the other surface which at least part serves as a plurality of external connecting terminals (11a) and, on one surface side, the integrated circuit element (12) is covererd with a sealing resin (15).read more
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References
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TL;DR: In this article, a memory card includes a card support formed by two plastic boards; a printed circuit board mounted on the card support; an integrated circuit mounted on a printed-circuit board and including a memory for storing information, and access terminals connected to the memory and central processing unit for accessing the information from the memory.
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