Patent
Method for depositing a metal on a surface
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TLDR
In this paper, the method of depositing a metal on a surface especially suitable for the manufacture of printed circuit boards includes coating the surface with a sensitizing solution comprising an inaqueous solvent solution, a reducible salt of a non-noble metal, a salt of 2,7 anthraquinone disulfonic acid and a polyol type secondary reducing agent such as sorbitol.Abstract:
The method of depositing a metal on a surface especially suitable for the manufacture of printed circuit boards includes coating the surface with a sensitizing solution comprising an inaqueous solvent solution, a reducible salt of a non-noble metal, a salt of 2,7 anthraquinone disulfonic acid and a polyol type secondary reducing agent such as sorbitol. The coated surface is then dried and the dried surface may be stored for extended periods of time before further processing which consists of imaging the sensitized surface with ultraviolet light and electrolessly plating a metal over the imaged surface.read more
Citations
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Method of forming articles including waveguides via capillary micromolding and microtransfer molding
Enoch Kim,Younan Xia,Milan Mrksich,Rebecca J. Jackman,Xiao-Mei Zhao,Stephen P. Smith,Mara Prentiss,George M. Whitesides,Christian Marzolin +8 more
TL;DR: In this paper, a waveguide and cladding can be subject to different polymerization or cross-linking conditions to alter the difference in refractive index between cladding and waveguide at any desired location of the array.
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Charles W. C. Lin,Ian Y. K. Yee +1 more
TL;DR: In this paper, a method for electrolessly plating an overcoat metal on a metal conductor disposed on a dielectric surface of a substrate was proposed, which includes removing carbonized film from the dielectrics surface by applying a plasma discharge, acid treating the metal conductor by dipping the substrate in a first acid solution in order to clean the surface of the metal, activating the metal conductors to allow electroless plating thereon by dipping substrate in metal activator solution, deactivating the surface to prevent electro-plating there on the surface, and plating
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Deposition of substances on a surface
TL;DR: In this article, a desired pattern is produced without removing from the substrate a substantial quantity of either the precursor or the deposited coating, and the desired pattern has a high purity of at least 80 % by weight.
References
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Patent
Electroless nickel plating
TL;DR: HIGH STABILITY, AUTOCATALYTIC ELECTROLESS NICKEL PLATING BATH COMPRISING an AQUEOUS SOLUTION CONTAINing about 0.08-016 MOLE/LITER NICKels IONS, about 019-0.38 MOLE / LITER HYPOPHOSPHITE IONS and ESSENTIALLY about 035-3.14 MOLE or Liter CITRATE IONS as discussed by the authors.
Patent
Sensitized substrates for chemical metallization
TL;DR: In this article, the authors provided new articles of manufacture suitable for the production of metallized bodies, such as printed circuits, dials, nameplates, metallised plastics, glass, ceramics and the like, comprising bases coated with a layer of copper, nickel, cobalt or iron salts or salt compositions.
Patent
Method for the production of radiant energy imaged printed circuit boards
TL;DR: In this paper, the authors proposed a method to produce metallic nuclei in the form of a non-conducting real image of the desired circuit pattern, rinsing the exposed base to remove unexposed metal salts and exposing the real image to an electroless metal bath to build up conductor lines of electroless metals thereon.
Patent
Process for the formation of real images and products produced thereby
Joseph Polichette,Leech Edward J +1 more
TL;DR: In this article, a real image of metal is formed on substrates by depositing reducible metal salt compositions thereon and exposing the coated substrates to radiant energy or a chemical reducing agent to reduce the metal salt to metallic nuclei.