New directions in aerospace packaging

TLDR: In this article, the potential impact of new commercial/industrial packaging brief 1 y reviewed, and the problems encountered in implementing the most prominent of these, the leadless chip carrier, is detailed together with proposed solutions.

Abstract: Electronic packaging is in the midst of an international revolution. Higher device lead counts and potder dissipation accentuate system space, weight, testability, and cost constraints. While commercial /industrial electronics moves toward a new generation of sophisticated plastic encapsulated surface mounted devices, the military/ aerospace designer still has a more restricted set of choices. Device packages suitable for aerospace applications will be reviewed, and relative advantages and disadvantages described. Problems encountered in implementing the most prominent of these, the leadless chip carrier, will be detailed together with proposed solutions. National and international standardization activities will be discussed, and the potential impact of new commercial/industrial packaging brief 1 y reviewed.