Patent
Overmolded semiconductor device having solder ball and edge lead connective structure
Paul T. Lin,Michael B. McShane +1 more
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TLDR
In this paper, a low-cost manufacturing method is used to fabricate a small multiple chip semiconductor device (10), in which a first pattern of conductive traces (14) is formed on one surface of a substrate (12), and a second pattern of traces (16) is created on a second surface of the substrate(12).Abstract:
A low cost manufacturing method is used to fabricate a small multiple chip semiconductor device (10). In one embodiment, a first pattern of conductive traces (14) is formed on one surface of a substrate (12), and a second pattern of traces (16) is formed on a second surface of the substrate (12). A first semiconductor die (20) is interconnected to the first traces (14), and a package body (24) is formed around the first die and a portion of the traces. A second semiconductor die (26) is interconnected to the second traces (16) on the second surface. A second package body (28) is formed around the second die and a portion of the traces (16). Solder balls (32) are coupled to exposed portions of the second traces (16) around the perimeter of the package body (28) to establish external power and ground connections to each die. Edge leads (36) are externally soldered to the traces (14 & 16) around the periphery of the substrate (12) to establish remaining electrical connections.read more
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Semiconductor device and method of manufacturing the same
TL;DR: In this paper, a method for manufacturing a semiconductor device of MCP structure, in which multiple semiconductor chips are provided in a single package and a method of manufacturing the same, that prevents damage of semiconductor chip that does not require burn-in and ensures the initial reliability of the semiconductor Chip that requires the burnin, are provided.
Patent
Single piece package for semiconductor die
TL;DR: In this article, a method for packaging a bare semiconductor die using a one piece package body with a pattern of external conductors is provided, which includes a die mounting location and an interconnect opening that aligns with the bond pads on the die.
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Stacked leads-over chip multi-chip module
TL;DR: In this paper, a multi-chip module (MCM) and method of manufacturing is disclosed that provides for attachment of semiconductor dice to both sides of the MCM printed circuit board (PCB).
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TL;DR: In this paper, a stackable FBGA package is configured such that conductive elements are placed along the outside perimeter of an integrated circuit (IC) device mounted to the FBGA.
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TL;DR: In this paper, a stackable chip scale semiconductor package and a method for fabricating the package are provided, which includes a substrate having a die mounting site wherein a semiconductor die is mounted.
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Patent
Semiconductor device having stacking structure
TL;DR: A semiconductor device includes a base semiconductor structure including semiconductor elements, interconnection layers for connecting the semiconductor element together, and conductive pads to which the interconnection layer is connected as discussed by the authors.
Patent
Flat package for integrated circuit devices
TL;DR: In this paper, a flat package for at least one integed circuit device having output pads comprises a supporting member for the IC device, a plurality of output terminals external to the package, an array of conductors connecting the output terminals to the said output pads of the device, and a protective means.
Patent
Baseboard for orthogonal chip mount
Satwinder Malhi,Kenneth E. Bean +1 more
TL;DR: A baseboard for orthogonal mounting of integrated circuit chips is described in this article, where a number of contact pads are formed adjacent each channel and are solder bonded to corresponding chip conductor pads.
PatentDOI
Gull-wing zig-zag inline-lead package having end-of-package anchoring pins
TL;DR: In this paper, an end-of-package anchoring device was proposed for rigidly fixing a semiconductor package to a circuit board such that each lead is in compressive contact with its associated mounting pad on the board.
Patent
Edge-mounted, surface-mount package for semiconductor integrated circuit devices
TL;DR: A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package to provide an area to solder to conductors on a PC board Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of a package adjacent the leads as discussed by the authors.