Patent
Pad structure of wiring board and wiring board
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TLDR
A pad structure of a wiring board is defined in this article, which is composed of a multi-plated layer comprising a metal layer (10) formed as a part of the conductive pattern and constituting the main body of the bump, a phosphorus-containing nickel layer (12) formed by electroless nickel plating and directly contacting with said metal layer, a copper layer (14) being formed on said nickel layer, having a thickness less than that of the nickel layer and a noble metal layer of the noble metal.Abstract:
A pad structure (40) of a wiring board being provided on a conductive pattern of the board and having a solder bump (20) mounted thereon, which is composed of a multi-plated layer comprising a metal layer (10) being formed as a part of the conductive pattern and constituting the main body of the bump, a phosphorus-containing nickel layer (12) being formed by electroless nickel plating and directly contacting with said metal layer, a copper layer (14) being formed on said nickel layer by electroless copper plating and having a thickness less than that of the nickel layer and a noble metal layer (16) being formed on said copper layer by electroless plating of the noble metal. The above pad structure of a wiring board allows, in a pad having a phosphorus-containing nickel layer, the improvement of the tensile strength of a solder member mounted thereon, such as a solder ball, or an external member soldered.read more
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Patent
Wiring board and method of manufacturing the same
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References
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Patent
Semiconductor device having bump electrode
TL;DR: In this paper, the UBM of the present invention is characterized by using the titanium layer with a closed-loop shape as the adhesion layer, and using the first copper layer which is directly contacted with the copper contact pad, to provide a better electrical performance.
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