Patent
Preflux, flux, solder paste and method of manufacturing lead-free soldered body
Reads0
Chats0
TLDR
In this paper, a flux which is designed to be used in a soldering using a lead-free and zinc-free solder containing tin as a major component and not containing lead is presented.Abstract:
There is closed a flux which is designed to be used in a soldering using a lead-free and zinc-free solder containing tin as a major component and not containing lead, the soldering being adapted to be applied to a surface portion which is constituted by a copper-based metal and/or a nickel-based metal (excluding the case where the surface portion is constituted by electroless nickel plating), wherein the flux contains at least one kind of material selected from the group consisting of a copper-based metal, a nickel-based metal, an inorganic salt of copper-based metal and/or a nickel-based metal, an inorganic complex of copper-based metal and/or a nickel-based metal, and an organic complex of copper-based metal and/or a nickel-based metal (a metal complex of an organic compound where atoms of N, O and S in amine (excluding nitrogen-containing hetrocyclic compounds), imine (excluding nitrogen-containing hetrocyclic compounds), oxime, ketone, alkoxy and thioketone are coordinated with a metal). There is also closed a method of manufacturing a lead-free soldered body wherein this flux is employed.read more
Citations
More filters
Patent
Metallic surface enhancement
TL;DR: In this article, a method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate.
Patent
Anti-tarnish coatings
TL;DR: In this paper, a method for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate was proposed, which consists of depositing a metallic surface layer comprising a precious metal on a surface by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule including at least three functional groups that interact with and protect copper surfaces.
Patent
Penetration enhancing flux formulation for tungsten inert gas (TIG) welding of austenitic stainless steel and its application
TL;DR: A Penetration Enhancing Activating Flux (PEAF) in paste form for autogenous TIG welding of austenitic stainless steels adapted for ready application with a brush on top weld surface prior to conducting auto-tIG welding to favour single weld pass, of AISI 304LN and AISIs 316LN varieties with weld bead penetration up to a section thickness of 12 mm as mentioned in this paper.
Patent
Self assembled molecules on immersion silver coatings
TL;DR: In this paper, a method for enhancing the corrosion resistance of an article comprising a silver coating deposited on a solderable copper substrate is provided, which comprises exposing the copper substrate having the immersion-plated silver coating thereon to an anti-corrosion composition comprising: a) a multi-functional molecule comprising at least one organic functional group that interacts with and protects copper surfaces and at least 1 organic functional groups that interact with and protect silver surfaces; b) an alcohol; and c) a surfactant.
Patent
Flux for soldering and circuit board
TL;DR: In this article, a flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex, which is used when soldering is performed onto a circuit having electroless nickel plating.
References
More filters
Patent
Method of making lead-free solder and solder paste with improved wetting and shelf life
TL;DR: Solder compositions, solder pastes and methods of manufacturing thereof having a solder material coated with a coating material by an immersion coating process or an electroless plating process are described in this article.
Patent
Thermosetting soldering flux and soldering process
TL;DR: A soldering flux suitable for soldering of small electronic components comprises 0.1-50 mass percent of an organic acid, 5-40 mass% of a solvent, and 10-95 mass % of a thermosetting resin (including a curing agent).
Patent
Etchant for copper or copper alloys
TL;DR: An etchant for copper or copper alloys comprising 5-50 wt % of an alkanolamine, a copper ion source in the amount of 0.2-10 Wt % as copper, a halide ion source and the balance water, wherein the molar ratio of the alkanolamines to one mol of the aliphatic carboxylic acid is two or more as mentioned in this paper.
Patent
Flux for use in soldering of stainless steels
TL;DR: In this paper, the authors present a flow control system for use in solving stainless steels in order to solve the problem of stainless steel, which is a major problem in the use of ORTHOPHOSPHORIC ACID.
Patent
Solder precipitating composition and solder precipitation method
TL;DR: In this article, a lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles is provided.