Patent
Printed circuit board with high heat dissipation
TLDR
In this paper, a printed wiring board having electronic circuit devices such as semiconductors including a heat sink forming a housing for the printed wires board, one of the electronic devices being mounted on one portion of a heat spreader that is formed of a material having high thermal conductivity, another portion forming a thermal energy flow path to the heat sink, thereby lowering the junction temperature at the electronic device and increasing the reliability of the wiring board.Abstract:
A printed wiring board having electronic circuit devices (13, 44) such as semiconductors including a heat sink forming a housing (32, 36) for the printed wiring board, one of the electronic devices (13) being mounted on one portion (12) of a heat spreader that is formed of a material having high thermal conductivity, another portion (10) of the heat spreader forming a thermal energy flow path to the heat sink, thereby lowering the junction temperature at the electronic device (13) and increasing the reliability of the wiring board.read more
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Patent
Clip on heat exchanger for a memory module and assembly method
TL;DR: In this paper, an apparatus for dissipating heat generated by electronic components on a surface of a memory module and a method of assembling the apparatus is provided, which includes substantially identical first and second heat exchanger members, each having a heat spreader member thermally coupled to a heat sink member.
Patent
Housing for diverse cooling configuration printed circuit cards
TL;DR: In this paper, a printed circuit card housing provides separate cooling fluid travel paths for convectively cooling on-board heat exchangers of non-mil. spec. component-retaining printed circuit cards, and for thermal conductive cooling of conventional (VME) circuit cards.
Patent
Method of manufacture of ceramic composite wiring structures for semiconductor devices
L. deRochemont,Peter Farmer +1 more
TL;DR: In this paper, a dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network.
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TL;DR: In this paper, a sealed housing for cooling a plurality of printed circuit cards includes a chassis that supports a number of electrical connectors retaining printed circuit card in mutually adjacent, spatially separated relationship.
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Light-emitting device, flexible light-emitting device, electronic device, lighting apparatus, and method of manufacturing light-emitting device and flexible-light emitting device
TL;DR: In this article, the authors proposed a simple method of manufacturing a light-emitting device or a flexible light emitting device with low surface temperature, a long lifetime, and high reliability.
References
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Patent
High performance overmolded electronic package
Michael B. McShane,Paul T. Lin +1 more
TL;DR: In this article, a thermally conductive insert is attached to one side of a substate, which protrudes through the cavity in the substrate. An electronic component, such as an IC, is then mounted on the pedestal and electrically connected to a conductive metal pattern on one of the layers of the substrate, leaving the distal ends of the leads and the back side of the insert exposed.
Patent
Packaging electrical components
TL;DR: In this paper, the circuit board lies generally parallel to the lower internal surface with the electrical components held in an internal space between a circuit board and the upper internal surface, and conductive terminal pins extend from outside the enclosure into the internal space.
Patent
Pluggable electronic circuit package assembly with snap together heat sink housing
TL;DR: A pluggable electronic circuit package assembly for use with an edge type connector has a two piece heat sink housing as discussed by the authors, which has internal retention posts and internal posts receiving recesses that allow the two pieces to snap fit together for easy assembly and disassembly.
Patent
Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
TL;DR: In this paper, a printed wiring board base for reception of one or more circuit chips, and a conductive heat sink and cover are used to protect the chips from electrostatic discharges.
Patent
Three dimensional packaging arrangement for computer systems and the like
TL;DR: In this paper, a three dimensional arrangement for packaging planar arrays of circuit components in a plurality of essentially planar layers in which the layers lie closely adjacent to one another is disclosed.