B
Bahgat Sammakia
Researcher at Binghamton University
Publications - 366
Citations - 6240
Bahgat Sammakia is an academic researcher from Binghamton University. The author has contributed to research in topics: Heat sink & Heat transfer. The author has an hindex of 30, co-authored 350 publications receiving 5687 citations. Previous affiliations of Bahgat Sammakia include University of Pennsylvania & Pennsylvania State University.
Papers
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Book
Buoyancy-Induced Flows And Transport
TL;DR: In this paper, a general formulation of buoyancy-induced fluid flows is presented, including external Vertical Thermally Induced Flows and Vertical Axisymmetric Flows.
Journal ArticleDOI
Thermal Challenges in Next-Generation Electronic Systems
Suresh V. Garimella,Amy S. Fleischer,Jayathi Y. Murthy,A. Keshavarzi,Ravi Prasher,Chandrakant D. Patel,Sushil H. Bhavnani,Rama Venkatasubramanian,Ravindranath V. Mahajan,Yogendra Joshi,Bahgat Sammakia,B.A. Myers,L. Chorosinski,Martine Baelmans,P. Sathyamurthy,Peter E. Raad +15 more
TL;DR: The thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this article.
Journal ArticleDOI
Bending Fatigue Study of Sputtered ITO on Flexible Substrate
TL;DR: In this article, high cycle bending fatigue experiments were conducted on ITO coated PET substrate and high magnification images were obtained to observe crack initiation and propagating in the ITO layer.
Patent
Pluggable electronic circuit package assembly with snap together heat sink housing
TL;DR: A pluggable electronic circuit package assembly for use with an edge type connector has a two piece heat sink housing as discussed by the authors, which has internal retention posts and internal posts receiving recesses that allow the two pieces to snap fit together for easy assembly and disassembly.
Patent
Electronic package with heat spreader member
Morris Anschel,Bahgat Sammakia +1 more
TL;DR: In this paper, the authors show that the coefficient of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar in order to provide an effective heat path from the heat generating device to the corresponding, much larger heat sink.