Patent
Process and apparatus for splitting flat pieces of brittle material, particularly of glass
Andrew Blunck,Heinz-Georg Geissler,Dirk Hauer,Christoph Hermanns,Bernd Hoetzel,Heinrich Ostendarp,Jürgen Stein,Ralf Steinfartz +7 more
Reads0
Chats0
TLDR
In this paper, a relative motion of the workpiece material and a symmetric heat radiation spot along a separation line is proposed, with subsequent cooling of the heated separation line section.Abstract:
The method involves a relative motion of the workpiece material (1) and a symmetric heat radiation spot (3) along a separation line (2), with subsequent cooling of the heated separation line section. The heat radiation spot has a higher radiation intensity on its edge zone and a maximum temperature at its back end. The spot with higher heat radiation on a V or U shaped curve (4) has a maximum temperature which is below the melting point of the workpiece material at the vertex (16). The apparatus includes a heat radiation source, particularly a laser, and an optical system for producing a radiation spot with the required characteristics. It further includes means for producing a relative motion of the workpiece and the heat radiation spot, as well as means for subsequent cooling the radiated separation line.read more
Citations
More filters
Patent
Method and apparatus for separating non-metallic materials
TL;DR: In this article, an integrated cracking device for splitting non-metallic substrates includes a laser for generating a laser beam and a quenching nozzle to quench the substrate at a defined region defined within the heat affected zone.
Patent
Method for cutting thin glass with special edge formation
Thomas Wiegel,Jürgen Vogt,Andreas Habeck,Georg Sparschuh,Holger Wegener,Gregor Kübart,Angelika Ullmann +6 more
TL;DR: In this article, a method for separating a thin glass sheet, such as a glass film along a predefined cutting line provides the cutting line immediately has a temperature of greater than 250 K below the transformation point.
Patent
Laser separated die with tapered sidewalls for improved light extraction
Ivan Eliashevich,Mark Gottfried +1 more
TL;DR: In this article, a method for separating individual optoelectronic devices, such as LEDs, from a wafer includes directing a laser beam (256) having a width toward a major surface of the semiconductor wafer.
Patent
Method for producing small, sheet glass plates and larger sheet glass plates as semi-finished products for producing the former
TL;DR: In this article, a larger sheet glass plate is patterned on both sides using a screenprinting or stencil-printing process and preferably using laser beam treatment along desired predetermined breaking points.
Patent
Method and device for cutting a flat glass plate into a number of rectangular plates
TL;DR: In this paper, the cutting up of a flat glass plate with predetermined edge lengths is typically effected by means of a laser, which is displaced along the cutting lines, in conjunction with a trailing cooling spot for inducing a thermomechanical stress that is greater than the breaking strength of the glass, and by a mechanically induced initial crack at the beginning of the cutting line.
References
More filters
Patent
Method and apparatus for cutting a brittle body with laser radiation
TL;DR: In this paper, the laser beam is projected with suitable focusing optics onto the surface of the body in such a way that it irradiates the entire cutting line at the same time.
Patent
Method of cutting non-metallic materials and a device for carrying out said method
TL;DR: In this paper, a method of cutting non-metallic materials using thermoelastic stresses was proposed, which involves heating the line using a laser beam whose power density distribution at the material surface in the cross-section across the beam centre diminishes from the periphery of the beam to the centre, the beam shape at the surface substantially matching the cutting contour.
Patent
Method of cutting hollow glass
Walter Doell,Joachim Beinert,Marcus Roth,Dieter Stahn,Martin G. Schinker,Rainer Kolloff,Gerd Spies +6 more
TL;DR: In this paper, a starting crack is made on a section on the separation line, which continues over the entire circumference to form a separation crack of high quality so that regrinding of the separation surface is not necessary.
Patent
Appliance for the contactless changing of the surfaces of objects
TL;DR: In this paper, the authors present a method to remove the laser marking of glass using a sharp-edged removal without macroscopic chips without the need of microscopy chips.
Patent
Process for controlling the laserbeam intensity repartition for processing element surfaces
TL;DR: In this article, the beam intensity distribution, produced on a component surface during beam shaping, is adjusted independently of the selected shape and size of the scanned surface region, without the need for action on the laser.