Patent
Resist material and pattern forming method
TLDR
In this paper, a pattern-forming method was proposed for PED-stabilizer-containing resist material having high sensitivity and high resolution, and sufficient PED stability, provided that the resist material contains at least one compound selected from thiol derivatives, disulfide derivatives and thiolsulfonate derivatives.Abstract:
Provided are a PED-stabilizer-containing resist material having high sensitivity and high resolution, and sufficient PED stability; and a pattern forming method using the resist material. More specifically, the resist material contains at least one compound selected from thiol derivatives, disulfide derivatives and thiolsulfonate derivatives. This resist material may further contain a dissolution inhibitor and/or surfactant. The pattern forming method comprises steps of applying the resist material to a substrate; after a heat treatment, exposing the substrate to a high energy beam or electron beam through a photomask; and after an optional heat treatment, developing the resist material with a developer.read more
Citations
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Patent
Positive resist composition and pattern-forming method using the same
TL;DR: In this article, the authors defined a positive resist composition comprising at least one compound selected from a compound capable of generating an acid represented by the formula (I) as defined herein upon irradiation with actinic rays or radiation.
Patent
Radiation-sensitive resin composition
TL;DR: A radiation sensitive resin composition comprising a fluorine-containing copolymer of hexafluoropropylene, at least one compound selected from the group consisting of unsaturated carboxylic acids and unsaturated carbonyl anhydrides, and an unsaturated compound (B) an acid generating compound which generates an acid upon exposure to radiation; (C) a crosslinkable compound; and (D) an organic solvent.
Patent
Positive photosensitive composition
TL;DR: A positive photosensitive composition comprises a compound capable of generating a specified sulfonic acid upon irradiation with one of an actinic ray and radiation and a resin capable of decomposing under the action of an acid to increase the solubility in an alkali developer as mentioned in this paper.
Patent
Polymer, resist composition and patterning process
Yuji Harada,Jun Hatakeyama,Yoshio Kawai,Masaru Sasago,Masayuki Endo,Kazuhiko Maeda,Haruhiko Komoriya,Michitaka Ootani +7 more
TL;DR: In this article, a polymer obtained through copolymerization of a monomer having a hexafluoroalcohol pendant whose hydroxyl moiety has been protected is used as an additive to a photoresist composition for immersion lithography.
Patent
Positive photoresist composition
TL;DR: In this paper, a positive photoresist composition is proposed for use in the production of a semiconductor device, which ensures high resolution, reduced edge roughness of a line pattern and a small number of development defects.
References
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Patent
Radiation-sensitive resin composition
TL;DR: In this paper, the problem of obtaining a radiation-sensitive compsn. which can form a good pattern and especially has high adhesion property to a substrate and which can easily be removed not by peeling with a peeling liquid but by dissolution peeling method, by incorporating at least an alkali-soluble resin having a specified compd. as one component of the monomers.
Patent
Positive resist composition
TL;DR: In this article, a positive resist composition of a hydroxypolyamide with a photoactive component and a general formula (I) and a photo active component (II) was proposed.
Patent
Radiation-sensitive resin composition
TL;DR: A radiation sensitive resin composition comprising a fluorine-containing copolymer of hexafluoropropylene, at least one compound selected from the group consisting of unsaturated carboxylic acids and unsaturated carbonyl anhydrides, and an unsaturated compound (B) an acid generating compound which generates an acid upon exposure to radiation; (C) a crosslinkable compound; and (D) an organic solvent.
Patent
Resist composition and patterning process
TL;DR: In this article, a resist composition is provided comprising a silicone resin, a photoacid generator, a nitrogen-containing organic compound, and a solvent, which overcomes the problem of a low selective etching ratio between resist film and organic film during oxygen reactive etching.
Patent
Radiation sensitive composition for color filters
TL;DR: In this paper, a radiation sensitive composition for color filters comprising a colorant, a binder polymer, a poly-functional monomer, and a photopolymerization initiator containing at least one biimidazole compound was proposed.