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Review of the current situation of ultra-precision machining
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This article is published in Chinese Journal of Mechanical Engineering.The article was published on 2007-01-01. It has received 30 citations till now. The article focuses on the topics: Machining.read more
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Mimicking the biological world: Methods for the 3D structuring of artificial cellular environments
Andreas Schober,Uta Fernekorn,Sukhdeep Singh,Gregor Schlingloff,Michael Gebinoga,Jörg Hampl,Adam Williamson +6 more
TL;DR: Representative developments in this research area are described and the fusion of formerly unrelated disciplines that are generating new beneficial applications in life sciences are described.
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CFD modelling of a novel hydrodynamic suspension polishing process for ultra-smooth surface with low residual stress
TL;DR: In this paper, a hydrodynamic suspension polishing (HSP) method was presented and the Computational Fluid Dynamics (CFD) based model has been numerically developed to explore the particle impact velocities and impact angles near the target surface induced by the rotation of the designed polishing plate.
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Influence of fixed abrasive configuration on the polishing process of silicon wafers
TL;DR: In this paper, the relationship among abrasive configuration, trajectory distribution, material removal, and its influence on wafer surface quality was studied by adopting a written Matlab program to give set values of the radial distance and the initial angle of abrasives fixed on the pad surface.
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Optimization of the Polishing Parameters for the Glass Substrate of STN-LCD
Chi-Hsiang Lien,Y. H. Guu +1 more
TL;DR: In this article, the optimal control parameters for the polishing of the glass substrate of super-twisted nematic-liquid crystal display (STN-LCD) were explored.
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An experimental investigation of flat polishing with dielectrophoretic (DEP) effect of slurry
TL;DR: In this article, the DEPP mechanism was analyzed in real-time with a specially designed video recording system to show the influence of electric field intensity and frequency upon DEP force.