Patent
Semiconductor integrated circuit, electronic device, solid-state imaging apparatus, and imaging apparatus
TLDR
In this paper, a semiconductor integrated circuit includes a first semiconductor substrate in which a part of an analog circuit is formed between the analog circuit and a digital circuit, and a substrate connection portion which connects the first and second semiconductor substrates to each other.Abstract:
A semiconductor integrated circuit includes a first semiconductor substrate in which a part of an analog circuit is formed between the analog circuit and a digital circuit which subjects an analog output signal output from the analog circuit to digital conversion; a second semiconductor substrate in which the remaining part of the analog circuit and the digital circuit are formed; and a substrate connection portion which connects the first and second semiconductor substrates to each other. The substrate connection portion transmits an analog signal which is generated by a part of the analog circuit of the first semiconductor substrate to the second semiconductor substrate.read more
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TL;DR: In this paper, the first and second semiconductor substrates are laminated with sealing resin, with a sealing resin interposed between them. Butts et al. showed that the sealing resin can be used to protect an on-chip lens from the pixel region of the first semiconductor substrate.
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Solid-state imaging device, method for producing solid-state imaging device, and electronic apparatus
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References
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Patent
Semiconductor image sensor module and method of manufacturing the same
Shin Iwabuchi,Makoto Motoyoshi +1 more
TL;DR: In this paper, a CMOS type semiconductor image sensor module is provided by stacking a first semiconductor chip, which has an image sensor wherein a plurality of pixels composed of a photoelectric conversion element and a transistor are arranged, and a second semiconductor chips, which have an A/D converter array.
Patent
Semiconductor module and mos solid-state imaging device
TL;DR: In this article, the authors proposed a solution to improve image processing speed and realize concurrent operations in a screen, easiness in manufacturing process simultaneously with improvement in image quality, improvement of manufacturing yield, and suppression of current consumption for simultaneously driving all pixels or many pixels in a semiconductor module provided with a MOS solid-state imaging device.
Patent
Solid-state imaging element
Tei Narui,禎 成井 +1 more
TL;DR: In this paper, the authors proposed a method to enhance sensitivity and reduce cross talk even when a pixel size is fine, by using photoelectric conversion parts and barrier region 35, which is formed in the N-type semiconductor layer to surround a periphery of each charge accumulation part.
Patent
Solid-state imaging device
TL;DR: In this paper, a frame member 300 is provided on a peripheral surface of a glass 120, provided with a reference protruding part 310 and a reference pit part 320 for fitting/adjustment.
Patent
Solid state imaging device and equipment using the same
TL;DR: In this article, the authors proposed a small high-performance imaging device and its application to products at low cost by preventing noise superimposed on a timing pulse feed line from affecting the output of an imaging chip.
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