Patent
Substrate and substrate holder
TLDR
In this paper, a substrate having two parallel planar faces and an edge with a groove is simultaneously coated on both sides in a vacuum chamber, and the parallel faces are vertically disposed by a blade inserted into the groove so that while the substrate is coated an unobstructed path exists for the coating material to the faces.Abstract:
A substrate having two parallel planar faces and an edge with a groove is simultaneously coated on both sides in a vacuum chamber. The substrate is raised, lowered and held on edge while the parallel faces are vertically disposed by a blade inserted into the groove so that while the substrate is coated an unobstructed path exists for the coating material to the faces.read more
Citations
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Patent
A plasma enhanced chemical processing reactor and method
TL;DR: A plasma enhanced chemical processing reactor (10) and method is described in this paper, which includes a plasma chamber (18) including a first gas injection manifold (15) and a source of electromagnetic energy (12).
Patent
Plasma enhanced chemical processing reactor
TL;DR: In this paper, a plasma enhance chemical processing (PEPCP) was used to generate a layer of material on the wafer. But the method was not suitable for high temperature environments.
Patent
The dome: shape and temperature controlled surfaces
TL;DR: In this article, an HDP-CVD tool using simultaneous deposition and sputtering of doped and undoped silicon dioxide capable of excellent gap fill and blanket film deposition on wafers is presented.
Patent
Apparatus and method for high throughput sputtering
Dennis R. Hollars,Delbert F. Waltrip,Josef Bonigut,Robert M. Smith,Gary L. Payne,Robert B. Zubeck +5 more
TL;DR: In this paper, a high throughput sputtering apparatus with a plurality of integrally matched components is described, where the sputtering is performed by a set of sputtering chambers at variable velocities.
Patent
Magnetic particle trapper for a disk sputtering system
Jinliang Chen,Kinya Nippa +1 more
TL;DR: A magnetic particle trapper for use in a sputtering system includes a roller cover plate having a plurality of openings arranged and dimensioned to accommodate the rollers associated with a mechanical transport mechanism as mentioned in this paper.
References
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Patent
Method and apparatus for handling workpieces
TL;DR: In this paper, a semiconductor wafer is moved from a class 100 environment into a vacuum chamber in which pattern writing is performed on the chips by an electron beam without significantly affecting the vacuum level in the vacuum chamber.
Patent
Wafer transfer system
TL;DR: In this article, a system for the automated handling and transfer of wafers individually and repetitively to and between processing stations and cassettes is described, where a track-like conveyor engages a cassette holding a plurality of wafer in vertically facing alignment, to move same horizontally past a loading station of a processing chamber.
Patent
Method of making a magnetic disc
TL;DR: In this article, a method of making a magnetic disc wherein a magnetic layer is applied onto a temporary base, and the temporary base is then pressed into contact with both surfaces of a disc base plate simultaneously, with the magnetic layer thereon facing inwardly.