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Patent

Thin-film transistor and method of fabricating the same

Shigeo Aoki, +1 more
TLDR
A thin-film transistor comprises a source electrode and a drain electrode formed in a spaced-apart relation to each other on a substrate, a semiconductor layer formed over the source and drain electrodes, a gate insulating film formed on the semiconductor layers and a gate electrode on the gate INSulating film as discussed by the authors.
Abstract
A thin-film transistor comprises a source electrode and a drain electrode formed in a spaced-apart relation to each other on a substrate, a semiconductor layer formed over the source and drain electrodes, a gate insulating film formed on the semiconductor layer and a gate electrode on the gate insulating film. First and second ohmic contact layers are formed in the entirety of the surface regions of the semiconductor layer which are in contact with the source and drain electrodes.

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Citations
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References
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Patent

Method for making a thin film transistor

TL;DR: In this paper, a thin-film transistor (TFT) of a self-aligned structure is described, where a pair of a source electrode and a drain electrode are formed in alignment with a gate electrode and in contact with low resistance areas formed at both side portions of a semiconductor layer deposited on an insulating substrate.
Journal ArticleDOI

Dual-gate a—Si:H thin film transistors

TL;DR: Dual-gate accumulation mode thin film transistors have been fabricated for the first time in a-Si:H on bulk glass substrates in this article, where drain currents in the range of 5-10 µA were obtained for gate biases of 15 V.
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Method of producing thin film transistor array

TL;DR: In this article, a method of producing thin film transistor arrays and having at least 7 steps including: a first step of forming a first electrode layer uniformly over an insulating substrate, a second step forming electrodes, such as drain and source electrodes and bus bars with a desired pattern by photoetching the first electrode, a third step of creating a uniform semiconducting layer on the surface of the substrate having the patterned electrodes, a fourth step of successively forming a uniform insulating layer over the uniformly deposited semiconductor layer while keeping the array in a vacuum, a fifth step
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Method of manufacturing insulated gate thin film field effect transistors

TL;DR: In this paper, a method of manufacturing insulated gate thin film field effect transistors is disclosed in which first and second closely adjacent anodic oxidation electrodes are formed on an electrically insulating substrate, and a semiconducting layer is formed on the insulating substrategies and the electrodes are exposed.
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Thin film field effect transistors utilizing a polypnictide semiconductor

TL;DR: In this article, the Schottlky barrier thin film field effect transistor (SFLFET) was described and a process for the production of a transistor characterised by vacuum plasma sputtering of successive layers in contact of a semiconductor comprising MP x, where M represents at least one alkali metal; P; represents pnictide; and x ranges from 15 to infinity.