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Tin base lead-free solder composition containing bismuth, silver and antimony

Stanley Tulman
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TLDR
A lead-free solder composition of approximately 90% to 95% by weight tin, approximately 3% to 5% antimony, approximately 1% to 4.5% bismuth, and approximately 0.1% to 0.5%.
Abstract: 
A lead-free solder composition of approximately 90% to 95% by weight tin, approximately 3% to 5% by weight antimony, approximately 1% to 4.5% by weight bismuth, and approximately 0.1% to 0.5% by weight silver.

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Patent

Flip-Chip interconnections using lead-free solders

Panayotis Constantinou Andricacos, +9 more
TL;DR: In this paper, an interconnection structure suitable for the connection of microelectronic circuit chips to packages is provided, which pertains to the area-array or flip-chip technology often called C4 (controlled collapse chip connection).
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Lead-free tin-silver-copper alloy solder composition

W. K. Choi, +6 more
TL;DR: In this paper, a solder composition consisting of tin, silver, and copper is described, and it is shown that forming of Ag3Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase nucleated.
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Low toxicity alloy compositions for joining and sealing

Ulysses Ma, +1 more
TL;DR: A lead-free alloy for joining and sealing which is useful as a plumbing solder comprises from 0.08 to 20% by weight of bismuth, from 1.02 to 1.5% of a rare earth mixture and the balance tin, together with incidental impurities.
Patent

Lead-free alloy containing tin silver and indium

James A. Slattery, +1 more
TL;DR: The lead-free solder alloy compsn. as discussed by the authors has a solid phase transforming temp. in the range from 167 to 212°C and a liq. phase transforming temperature. It contains, by weight, 85 to 92% tin, 1 to 6% silver and 4 to 10% indium.
Patent

Lead free, tin-bismuth solder alloys

Stephen Gilbert Gonya, +3 more
TL;DR: The lead free alloy as mentioned in this paper is a low solidus temperature, multi-component solder alloy containing at least about 50 weight percent Bi, up to about 50 Weight Percent Sn (basis total Sn and Bi), and an effective amount of a physical and mechanical property enhancing third component.
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Tin base solder alloy

Cain John F, +1 more
TL;DR: A tin base solder alloy containing 1-5 percent by weight bismuth is described in this article.This alloy is useful in electrical applications and in particular to a high creep-strength tin base alloy containing Bismuth.