Patent
Tin-copper alloy electroplating bath and plating method using the same
Isamu Yanada,勇 梁田,Masanori Tsujimoto,雅宣 辻本,Tetsuro Okada,哲朗 岡田,Toru Murakami,透 村上,Tomomi Ieji,友美 家治 +9 more
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TLDR
In this paper, the univalent copper ions in the plating bath are stably subjected to complex formation to suppress the substitution reaction of copper and the precipitation of a copper compound.Abstract:
PROBLEM TO BE SOLVED: To provide a tin-copper alloy electroplating bath which contains one or >=2 kinds selected from at least a water-soluble tin salt, water-soluble copper salt inorganic acid, and organic acid as well as their water-soluble salts and which contains thiourea and its derivative, 2-mercapto group-containing aromatic compound and nonionic surfactant and a plating method using the same. SOLUTION: The univalent copper ions in the plating bath are stably subjected to complex formation to suppress the substitution reaction of copper and the precipitation of a copper compound, by which the management of the bath may be made easy and the stability of the bath may be enhanced. The tin-copper alloy plating film which imparts effective solderability to parts constituting electronic apparatus, such as chip parts, terminal parts, pressed parts, crystal oscillators, bumps, connectors, connector pins, lead frames, various hoop materials, lead pins of packages, pin grid arrays, ball grid arrays and circuits of printed circuit boards and is effective for etching resist may be eventually formed as a substitute for tin-lead alloy plating.read more
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Patent
Metal plating composition and method for the deposition of copper-zinc-tin suitable for manufacturing thin film solar cell
TL;DR: In this paper, a metal plating composition for the deposition of a copper-zinc-tin alloy is disclosed, wherein the alloy contains at least one chalcogen, at lease one zinc plating species, at least tin plating and at least complexing agent.
Patent
Tin-plated product and method for producing same
Hiroshi Miyazawa,Masami Saitou +1 more
TL;DR: In this article, a tin-plated product formed by electroplating a substrate in a tin plating solution, which contains carbon particles and an aromatic carbonyl compound, to form a coating of a composite material, on the substrate has a coefficient of friction which is not greater than 0.18, and a contact resistance of not less than 1.0 mΩ.
Patent
Whiskerless plated structure and plating method
Sakuyama Seiki,Kozo Shimizu +1 more
TL;DR: In this article, a plated structure is described that includes a base formed of a copper-based material containing copper as a major component, a plating film, and a tin-copper compound barrier film located at the boundary between the base and the plating.
Patent
Tin-copper-containing alloy plating bath, tin-copper-containing alloy plating method and article formed with tin-copper-containing alloy plating film
Seiki Tsuji,清貴 辻,Tetsuji Nishikawa,哲治 西川,Keigo Obata,惠吾 小幡,Takao Takeuchi,孝夫 武内,Hidemi Nawafune,秀美 縄舟 +9 more
TL;DR: In this article, the problem of providing a tin-and copper-containing plating bath which hardly gives rise to substitution deposition of copper to a tin anode, is low in the dependence of a plating film composition on current density, is good in bath stability and hardly give rise to clouding is addressed.
Patent
Flexible printed wiring board terminal and flexible flat cable terminal
TL;DR: In this paper, a flexible printed wiring board terminal and a flexible flat cable terminal are provided, each of which is a lead-free tin or tin alloy plated layer, forms almost no whiskers, and therefore has a low contact resistance.