X-Lase CoreScriber, Picosecond Fiber Laser Tool for High-Precision Scribing and Cutting of Transparent Materials☆
TLDR
In this paper, a transparent material scribing process and a laser tool, the X-Lase CoreScriber, have been developed for high precision glass dicing using transparent material internal modification with short and intense high repetition rate pslaser pulses.About:
This article is published in Physics Procedia.The article was published on 2013-01-01 and is currently open access. It has received 1 citations till now. The article focuses on the topics: Wafer dicing & Fiber laser.read more
Citations
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Journal ArticleDOI
Stealth dicing of sapphire sheets with low surface roughness, zero kerf width, debris/crack-free and zero taper using a femtosecond Bessel beam
TL;DR: In this paper, a femtosecond Bessel beam achieving a 200nm Ra cut surface roughness, which is almost an order of magnitude improvement over the previous bessel beam cutting approaches without losing the uniformity.
References
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Journal ArticleDOI
Evaluation of nonlinear absorptivity in internal modification of bulk glass by ultrashort laser pulses
TL;DR: Thermal conduction model is presented, by which nonlinear absorptivity of ultrashort laser pulses in internal modification of bulk glass is simulated, and shows that laser energy is absorbed by avalanche ionization seeded by thermally excited free-electrons at locations apart from the focus at pulse repetition rates higher than 100 kHz.
Patent
Method and apparatus for dicing a substrate using laser focussed inside the substrate for creating a weakened cutting line
Jarno Kangastupa,Tiina Amberla +1 more
TL;DR: In this article, a method for processing a substrate (18), such as glass and semiconductor wafers, is described. But the method is not suitable for the case of transparent materials.
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