How DBC control warpage during manufacturing process by control temp condition?
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Dynamic mold surface temperature control plays a crucial role in controlling warpage during the manufacturing process. Research has shown that by optimizing process parameters such as rapid heat cycle molding temperature (TRHCM), holding pressure (pn), and nozzle temperature (Tnozzle), significant reductions in warpage can be achieved . Additionally, the use of a temporary carrier technique, along with appropriate adhesives like polyimide, has been proven effective in controlling warpage during flip chip assembly processes . Furthermore, in immersion lithography for IC manufacturing, accurate temperature control during the Post Exposure Bake (PEB) process is essential to correct wafer warpage and ensure uniform CD control on production wafers . These findings highlight the importance of temperature control in mitigating warpage issues during various manufacturing processes.
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| Papers (5) | Insight |
|---|---|
11 Citations | The paper proposes adjusting the thermal loading condition during PCB fabrication to control warpage by approximating a nonlinear thermo-elasticity problem to a linear one based on stress-free state temperature. |
2 Citations | DBC controls warpage during manufacturing by correcting wafer warpage using a new PEB plate, ensuring accurate CD control by maintaining uniform temperature distribution on production wafers. |
15 May 2014 7 Citations | Dynamic mold surface temperature control in Rapid Heat Cycle Molding (RHCM) influences warpage by adjusting parameters like TRHCM, pn, and Tnozzle, with TRHCM dominant near the gate and pn more effective with increased flow length. |
3 Citations | DBC controls warpage during manufacturing by adjusting mold temperature. Optimal temperature ranges are crucial to prevent defects, with a maximum of 140°C recommended for effective production. |
01 May 2018 1 Citations | Temporary adhesive bonding with an aluminum carrier controlled warpage during mass reflow flip chip assembly by optimizing temperature conditions, reducing warpage to 20 µm compared to 40-100 µm without bonding. |
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