What are different types of plasma processing and technologies i?4 answersDifferent types of plasma processing and technologies include low-temperature plasma processing for material synthesis and device fabrication, plasma-based energy devices, and low-temperature plasma for complex systems. Additionally, plasma technology is utilized in the processing of biomedical waste, fuel biomass, and organic waste from various industries using high-temperature plasma methods. Plasma technology is widely employed in energy production from waste, biomass, and coal through methods such as plasma-assisted combustion, gasification, and pyrolysis, with different plasma torch systems like AC, DC, and RF being utilized for these applications. These diverse plasma processing techniques play crucial roles in various fields ranging from material science to energy production.
How is plasma generated?4 answersPlasma is generated through various methods. One method involves using carbon nanotubes (CNTs) as electron emitters, where an electric field is applied to the CNTs to improve electron transfer near the tip. Another method involves using a plasma generating device with a discharging assembly, where plasma is generated at the initial stage of discharge and then input into an air chamber for further reaction before being output for sterilization and disinfection. Inductively coupled plasma generating devices use an antenna coil and a high-frequency power source to generate plasma, with a resonance circuit providing electrical symmetry. A plasma generating device for atmospheric pressure discharge plasma application uses multiple discharge modules that can be adjusted to the shape of the treated surface, allowing for large-area, uniform plasma treatment. Additionally, plasma can be generated within a chamber by supplying radio-frequency power to an electrode and adjusting the frequency to optimize plasma generation.
How does plasma treatment affect the surface of a material?4 answersPlasma treatment can affect the surface of a material in several ways. It can improve the surface properties such as wettability and adhesion. Plasma treatment can also modify the surface finish of materials by introducing chemically reactive species and increasing the dissociation fraction of molecules. Additionally, plasma treatment can lead to surface reorientation motions and oxidative reactions, resulting in changes to the composition and properties of the surface layers. These changes can occur over extended periods of time after plasma processing, and the nature and densities of the chemical groups on the surface can vary considerably. Overall, plasma treatment is an effective method for improving the surface properties of materials, particularly in terms of adhesion and tribology.
Why polarization is important in plasmas?4 answersPolarization is important in plasmas because it affects various aspects of plasma behavior and interactions. In gyrokinetic theory, the polarization effects are analyzed by using hybrid coordinates, which include the nonlinearity of polarization displacement. The generation and transport of fast electrons in laser-plasma interactions are influenced by the polarization of the laser pulse. Plasma polarization spectroscopy provides valuable information about high energy density plasmas, including the existence, directionality, and energy of particle beams. In the context of AdS/CFT holography, the polarization coefficients of a strongly-coupled plasma are related to the tidal deformation coefficients of a black brane. The polarization properties of gamma photons emitted from a plasma can be used to probe the plasma dynamics and its susceptibility to quantum electrodynamical processes.
What are the effects of oxygen plasma processing on silicon direct bonding?3 answersOxygen plasma processing has various effects on silicon direct bonding. The activation time, activated power, and oxygen flow are the principal processing parameters that influence the bonding quality. The activated power has the most significant effect on the bonding ratio, followed by the oxygen flow, while the activation time has the least effect. Oxygen reactive ion etching (O2 RIE) plasma treatment results in highly reactive surfaces with the presence of Si(-O)2, which can play a role in hydrophilic wafer bonding at low temperatures. Sequential plasma activated bonding (SPAB) process, which includes oxygen RIE and nitrogen microwave radical plasma, improves tensile strength and surface roughness compared to the O2 RIE process. Plasma activations, such as reactive ion etch (RIE) or microwave (MW) plasma treatment, can induce strong bonding even at low temperatures, but can also lead to bonding defects during low-temperature annealing. Hydrogen plasma treatment is an efficient method for removing carbon contaminants on the silicon surface and activating the silicon surface for direct wafer bonding.
What are the phenomena of plasma?2 answersPlasma phenomena encompass a range of characteristics and processes. These include the understanding of metallic plasmas formed in low pressure or vacuum arcs, as well as the determination of elementary particle processes in plasma volume and at the plasma-surface interface. Key properties of plasma, such as quasi-neutrality, shielding, particle transport processes, and sheath formation, are also important aspects of plasma phenomena. Additionally, the discovery of QGP phenomena in small collision systems has challenged the basic paradigms of heavy-ion and high-energy physics. The non-equilibrium properties of the plasma of confining gluons resulting from Gribov quantization have been studied, including the calculation of bulk and shear viscosities. Recent advances in the physics of low pressure inductively coupled plasmas have revealed phenomena such as wave phase bifurcation, phase velocity reversal, and nonlinear effects induced by the rf Lorentz force.