What are the challenges in the printed circuit board manufacturing process?
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The challenges in the printed circuit board manufacturing process include: 1. Long assembly time and unsuitability for assembly line production when fixing four corners through screws, which can also damage the surface of the circuit board . 2. Difficulty in achieving uniform finish and easy visual judgment of defects during perforation cutting, without measuring the projection amount of a projection . 3. Ensuring excellent electrical conductivity in large-current flowing through-holes and secure reliability . 4. Discoloration of the silver surface and the need for effective protection of the carbon oil layer during the manufacturing process . 5. The need for a simple and easy-to-perform manufacturing process that produces circuit boards resistant to high temperature and high voltage, with high corrosion resistance and low expansion coefficient .
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| Papers (5) | Insight |
|---|---|
| The text does not mention any challenges in the printed circuit board manufacturing process. | |
Patent 17 Aug 2016 1 Citations | The challenges in the printed circuit board manufacturing process include discoloration of the carbon oil layer and yellowing of the silver surface. |
| The challenge in the printed circuit board manufacturing process is to ensure excellent electrical conductivity in large-current flowing through-holes while maintaining reliability. | |
| The challenges in the printed circuit board manufacturing process include long assembly time, potential damage to the circuit board surface, and uneven heating of the circuit boards. | |
| The challenge in the printed circuit board manufacturing process is to ensure uniform finish and easy visual judgment of defects without measuring projection amounts. |
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