What are the latest advances in LED thermal measurement?
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Recent advances in LED thermal measurement include the development of new methods and techniques for accurately measuring the thermal properties of high-power LEDs. One approach involves designing a different interface condition to change the contact thermal resistance between the device under test (DUT) and the heat sink, allowing for clearer separation of the thermal resistance curve . Another method utilizes thermoreflectance (TR) to measure the surface temperature of LEDs during high-power operation, providing accurate and reliable results . Additionally, an automated instrument has been developed for measuring the temperature dependence of voltampere and lumen-ampere characteristics of LEDs, allowing for stable and precise measurements . A new multi-LED chip junction temperature measurement technique has also been proposed, which enables the simultaneous measurement of temperatures for each LED chip in a complex LED structure, offering a promising solution for accurately measuring the temperature of multi-LED devices .
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| Papers (4) | Insight |
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01 Jun 2021 2 Citations | The paper discusses a new multi-LED chip junction temperature measurement technique for thermal characterization of LED light engines. It does not mention any other latest advances in LED thermal measurement. |
| The provided paper discusses an instrument for automated measurement of temperature dependence of voltampere and lumen-ampere characteristics of LEDs. It does not mention any specific latest advances in LED thermal measurement. | |
2 Citations | The paper discusses the use of thermoreflectance (TR) as a noncontact measurement technique for analyzing the thermal properties of LEDs. It shows that TR can provide accurate and reliable results for measuring the surface temperature of modern LEDs. |
| The paper discusses the use of a different interface condition to accurately measure the thermal resistance of high-power LEDs, as well as obtaining the structural thermal resistance between multiple layers on the heat flow path of the device. |
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