What is the facet temperature of a semiconductor laser?
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半导体激光器的刻面温度是影响其可靠性和运行性能的关键因素。已经提出了几种方法来减少刻面加热并最大限度地降低灾难性光学镜损坏（COMD）的风险。一种方法是使用电气隔离和泵浦窗口，与激光腔温度相比，这种窗户可以显著降低刻面温度 。另一种方法是单独泵浦窗口 (SPW) 技术，即刻面部分与激光部分进行电气隔离。该技术已被证明可以将刻面温度降低42％，并保持激光器的斜率效率 。钝化涂层（例如ZnSe）也被用来降低刻面温度和提高半导体激光器的COMD阈值 。COMD 的主要原因是光学吸收引起的半导体激光面氧化 。
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| Papers (5) | Insight |
|---|---|
| 半导体激光器的刻面温度可以使用基于注入电流和光功率的热源的理论模型来描述。 | |
12 Mar 2015 4 Citations | 使用ZnSe钝化涂层可以降低半导体激光器的刻面温度，该涂层可有效抑制氧化并提高灾难性光学镜损伤（COMD）阈值。 |
15 Apr 2015 2 Citations | 当驱动到更高的输出功率时，半导体激光器的刻面温度会升高，从而导致灾难性的光学损坏。 |
04 Mar 2019 7 Citations | 使用电动泵浦窗户可以显著降低半导体激光器的刻面温度。 |
09 May 2018 2 Citations | 通过实现单独泵浦窗口 (SPW) 区域，可以降低半导体激光器的刻面温度，从而使温度降低 42%。 |
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