Showing papers on "Flexible electronics published in 1992"
Patent•
11 May 1992TL;DR: In this article, a high speed semiconductor interconnect system which contains a plurality of signal traces, each in a flexible printed circuit, and each adhesively sandwiched between or adjacent to a flexible ground circuit and a flexible power circuit is presented.
Abstract: This invention creates a high speed semiconductor interconnect system which contains a plurality of signal traces, each in a flexible printed circuit, and each adhesively sandwiched between or adjacent to a flexible ground circuit and a flexible power circuit. The signal, power and ground circuits are stacked in multilayers and are connected to respective lead fingers and respective die circuits by standard, known methods such as TAB or wire bond and encapsulated in a known way. The ground plane and power plane being adjacent to the signal plane reduces the power-ground loop inductance and thus reduces the package noise. By reducing the inductance, the circuit can have a shorter switching time. Also, by adding the ground plane, the power-ground capacitance is increased, which serves to reduce the effect of power supply fluctuations in the system.
242 citations
Patent•
19 Aug 1992
TL;DR: In this paper, a method for electrically connecting flip chips to a flexible printed circuit substrate is described, which consists of providing solder paste to a plurality of active contact pads located on the substrate and heating the resulting assembly as a whole so that the solder paste on each active contact pad reflows to form an electrical connection with its corresponding solder bump.
Abstract: A method is described for electrically connecting flip chips to a flexible printed circuit substrate. The method comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad reflows to form an electrical connection with its corresponding solder bump.
182 citations
Patent•
08 Jun 1992
TL;DR: A flexible printed circuit board for use in a display unit of a camera is described in this paper, which includes a flexible substrate with a printed circuit pattern, a die of an integrated circuit chip mounted on said substrate for driving the display drive, a plurality of wires, and resin sealant for covering said integrated circuit chips.
Abstract: A flexible printed circuit board for use in a display unit of a camera, which includes a flexible substrate with a printed circuit pattern, a die of an integrated circuit chip mounted on said substrate for driving the display drive, a plurality of wires, and resin sealant for covering said integrated circuit chip The flexible substrate has first terminals to be in contact with a display device and second terminals in electric connections to said first terminals, respectively The die of the integrated circuit chip includes a plurality of connecting terminals The plurality of wires are for bonding said connecting terminals of the integrated circuit chip to said second terminals of said printed circuit pattern
38 citations
Patent•
17 Apr 1992
TL;DR: In this paper, a flexible sensor assembly for detecting optical pulses is presented, in which the flexible sensor is adapted to be folded so that the photoelectric detector can be spaced from and disposed over the light emitting diode.
Abstract: A flexible sensor assembly for detecting optical pulses in which said sensor assembly comprises a flexible printed circuit having mounted thereon at least one light emitting diode and at least one photoelectric detector connected to different circuit patterns with an insulative tape secured over the circuit and components and wherein the flexible sensor is adapted to be folded so that the photoelectric detector can be spaced from and disposed over the light emitting diode.
36 citations
Patent•
24 Sep 1992
TL;DR: In this article, a flexible printed circuit board is constructed to have a connector insertion portion having a width substantially the same as that of an insertion hole of a connector, and a plurality of metal terminals are placed in parallel on the board in such a manner that distal ends therof are situated adjacent to a distal end of the connector insertion part, and each metal terminal is fixedly bonded to a respective one of the electrically conductive patterns provided on the flexible circuit board.
Abstract: A terminal structure of a flexible printed circuit board includes a flexible printed circuit board and a plurality of metal terminals each consisting of a slender, elongated metal plate. The circuit board has a plurality of electrically conductive patterns provided on a resin film, a prescribed portion of which is formed to have a connector insertion portion having a width substantially the same as that of an insertion hole of a connector. The plurality of metal terminals are placed in parallel on the flexible printed circuit board in such a manner that distal ends therof are situated adjacent a distal end of the connector insertion portion, and each metal terminal is fixedly bonded to a respective one of the electrically conductive patterns provided on the flexible printed circuit board. The width of the connector insertion portion of the flexible printed circuit board to which the metal terminals have been attached is such that the connector insertion portion will not extend beyond the outer sides of the two outermost metal terminals on the longitudinal side edges of the connector insertion portion.
34 citations
Patent•
30 Sep 1992
TL;DR: In this paper, a low-cost mass production of flexible planar circuits is proposed, which suit particu-larly for one time use and carry complex prints on at least one face thereof, as may be e.g. RF sensitive tickets or marker tags for electronic security systems.
Abstract: The new method concerns the custom designed lowcost mass production of flexible planar circuits which suit particu-larly for one time use and carry complex prints on at least one face thereof, as may be e.g. RF sensitive tickets or marker tags for electronic security systems. The construction both of planar electrical circuit and printed outfit elements in mutual alignment with each other is based on continuous light printing routines in combination with a production carrier protection and a post etching routine. Light printing may be of the LASER, LED, LCS or like type. The method is computer orchestrated and rolls off prior art barriers in view of limits for custom designs of shape, face, outfit, electrical, and even RF properties of such circuits. Custom designs are easily layouted onscreen of a modern personal computer. The data obtained thereof are downloaded to the production line. Changing, hopping sweeping and tuning custom circuit and print designs, without any format restriction and at full process speed is unprecedentedly introduced. Forming tools have been abandoned. As an exclusive longlife production tool electromagnetic wave energy is extensively used. The production web can be selected from a wide choice of materials and thus define circuit properties from flexible printed circuit wafers over tear-resistive spunbond labels to paper-like tags or stickers which may even be washed and sewn and nicely go one way with a pretty commercial face.
32 citations
Patent•
16 Dec 1992
TL;DR: In this paper, a flexible printed circuit board on which a semiconductor type detector chip section is mounted is used for acceleration sensor, where the detector chip is formed with openings therethrough overlapping an opening formed in a rear-side base plate.
Abstract: A semiconductor type acceleration sensor comprises a flexible printed circuit board on which a semiconductor type detector chip section is mounted The detector chip is formed with openings therethrough overlapping an opening formed in a rear-side base plate of the flexible printed circuit board such that the detector chip section is supported only by a bridge portion. In case of excess input in an acceleration direction, elastic deformation of the bridge portion and a bending portion of the flexible printed circuit board provide absorption of tile excess input for protecting the detector chip section.
26 citations
Patent•
16 Sep 1992
TL;DR: In this article, it was shown that rigid printed circuits do not need to be permanently flexible in the flexible region in many cases, regions which withstand a limited number of bending stresses being adequate.
Abstract: Rigid-flexible circuits do not need to be permanently flexible in the flexible region in many cases, regions which withstand a limited number of bending stresses being adequate. Such rigid printed circuits, which are flexible only in parts, consist exclusively of rigid printed-circuit board material which, completely or partially, has a smaller thickness in the flexible regions than in the other regions.
24 citations
Patent•
01 May 1992
TL;DR: A multilayer flexible circuit board has two inner layers FPCs 1, 2 which are laterally connected as discussed by the authors, one FPC1 of both the layers is formed in a structure having more bents than those of the other layer FPC 2.
Abstract: PURPOSE:To provide a multilayer flexible circuit board having desired characteristics by combining materials for flexible printed circuit boards (hereinafter abbreviated to as 'FPC') responsive to necessary characteristics. CONSTITUTION:A multilayer flexible circuit board has two inner layers FPCs 1, 2 which are laterally connected. One FPC1 of both the layers FPCs 1, 2 is formed in a structure having more bents than those of the other layer FPC 2.
9 citations
Patent•
16 Nov 1992
TL;DR: In this paper, a mold-releasing cushion films are laid on flexible printed circuit boards to catch them from both sides, and those are boned at the positions where adhesives 18 are pasted, and at those positions these are cut with a cutter.
Abstract: PURPOSE:To facilitate press processing and make it efficient by automating the exfoliation work of a protective sheet material and the work of sticking a film cover lay to a circuit board. CONSTITUTION:A film coverlay 10, to which a protective sheet 11 is stuck by an adhesive 12, is veered out in the longitudinal direction as shown by an arrow A and is carried rectilinearly, and only the protective sheet material 11 is guided in the different direction by a guide roller 15 so as to exfoliate it from the film cover lay 10. A plurality of flexible printed circuit boards 16a, 16b, and 16c are stuck to the film cover lay 10, and then those are temporarily pressure-bonded by a hot platen 17. Both mold-releasing cushion films 21 and 22 are laid on the flexible printed circuit boards 16a, 16b, and 16c and the film coverlay 10 to catch them from both sides, and those are boned at the positions where adhesives 18 are pasted, and at those positions these are cut with a cutter. Hereby, both ends of the mold releasing cushion films are thermocompression-bonded to both sides of each film coverlay, and a member in independent shape can be gotten, and press processing work can be facilitated.
9 citations
Patent•
03 Mar 1992TL;DR: In this article, a polyimide film is described having improved adhesion prepared by coating the surface of a partially cured or partially dried polyamide acid film with an organic solvent solution of a metal salt and heating the coated film to both convert the polyamide acids to polyimides and dry the film.
Abstract: A polyimide film is described having improved adhesion prepared by coating the surface of a partially cured or partially dried polyamide acid film with an organic solvent solution of a metal salt and heating the coated film to both convert the polyamide acid to polyimide and dry the film. By proper selection of the metal salt either a one-side adherable or two-side adherable polyimide film can be obtained. The polyimide film can be used in electrical insulating and flexible printed circuit applications where superior adhesion is an important requirement.
Patent•
24 Jan 1992
TL;DR: In this article, a flexible pull tab and a surface mount connector attached on opposite sides of a flexible printed circuit board are disclosed and folded back so that the tab ends touch to ensure easy gripping for removal of connector perpendicular to the connector.
Abstract: A flexible pull tab and a surface mount connector attached on opposite sides of a flexible printed circuit board is disclosed. The flexible pull tab is folded back so that the tab ends touch to ensure easy gripping for removal of connector perpendicular to the connector.
Patent•
18 Feb 1992
TL;DR: In this paper, the end of a reinforcing plate, which is fixed on a flexible printed circuit board having a wiring pattern, is rounded, to decrease the breakage of the wiring pattern at the end face of a rounded reinforcing plate.
Abstract: PURPOSE:To decrease breakage of a wiring pattern at the end face of a rounded reinforcing plate the end of the plate. CONSTITUTION:The end of a reinforcing plate 3, which is fixed on a flexible printed circuit board 2 having a wiring pattern 1, is rounded.
Patent•
09 Sep 1992
TL;DR: In this paper, the authors propose a method to connect a rigid printed circuit board to flexible printed circuit boards and to delete the number of steps by matching marks to each other and fixedly connecting solders arranged near the marks.
Abstract: PURPOSE:To effectively connect a rigid printed circuit board to a flexible printed circuit board and to delete the number of steps by matching marks to each other and fixedly connecting solders arranged near the marks to each other. CONSTITUTION:Circularly positioning marks 31 provided on a flexible printed circuit board 20 correspond to inner peripheries of ringlike positioning marks 32 provided on a rigid printed circuit board. As a result of the positioning, contacts 12a, 2a of the ends of conductor patterns 12, 22 are precisely connected and soldered to one another. Simultaneously, since solders 41, 42 provided near the peripheries of the marks 31, 32 are brought into contact with one another, soldering is conducted, and boards 11, 12 are rigidly secured to one another. Thus, even if the board 20 is deflected, the connection of the superposition of the board 10 is not peeled due to the securing of the solders 41, 42.
Patent•
[...]
26 Nov 1992
TL;DR: In this paper, the authors present a method to obtain a double-layer flexible printed circuit board capable of high-density wiring and excellent in heat resistance by press-bonding a semi-cured polyamic acid film perforated as predetermined and elongated by a specified value or more onto a conductor foil and then by completing imidization.
Abstract: PURPOSE:To obtain a double-layer flexible printed circuit board capable of high-density wiring and excellent in heat resistance by press-bonding a semi- cured polyamic acid film perforated as predetermined and elongated by a specified value or more onto a conductor foil and then by completing imidization. CONSTITUTION:A mold release film or a mold release drum is coated with a polyamic acid solution and dried until a tackfree state to form a polyamic acid film. Thereafter, this film is peeled off from the mold release film or the mold release drum and only an amic acid film is elongated by 10% or more at a specified temperature and under a specified tension and then formed into a polyamic acid film. This polyamic acid film is perforated together with a polyimide film by a normal method such as punching or cutting. Next, the perforated polyamic acid film is hot press-bonded onto a conductor foil and then imidized sufficiently to form into a double-layer flexible printing board having perforations.
Patent•
04 Nov 1992
TL;DR: In this article, the membrane control panel is attached by adhesive to a continuous mounting region, which is integral with, and protrudes from, the oven casing and may have an opening for a display, an opening 23b for a door opening button 25 and a slot 23c for the flexible printed circuit of the membrane panel 24.
Abstract: To simplify construction and improve reliability and durability, the membrane control panel 24 is attached, eg by adhesive, to a continuous mounting region 23 which is integral with, and protrudes from, the oven casing 20. The mounting region 23 may have an opening 23a for a display, an opening 23b for a door opening button 25 and a slot 23c for the flexible printed circuit of the membrane panel 24.
Patent•
04 Jun 1992
TL;DR: In this paper, a thin, lightweight optical source/receiver unit adapted for application to the human forehead, for use in a cerebral oximeter, has a source of electromagnetic radiation of selected wavelengths (36) (e.g., light in the near infrared range) at a first position and a pair of sensors located at particular and differing distances from the source.
Abstract: A thin, lightweight optical source/receiver unit (12) adapted for application to the human forehead, for use in a cerebral oximeter, has a source of electromagnetic radiation of selected wavelengths (36) (e.g., light in the near infrared range) at a first position and a pair of sensors located at particular and differing distances from the source. The source may comprise light-emitting diodes (36a-36b) and the detectors may comprise photosensors (32, 34), all of which are preferably mounted on a small and flexible printed circuit strip (30). Electromagnetic shielding (42) substantially surrounds the source and detectors as well as the adjacent electrical conductors associated with each. The shielded printed circuit (30) and components are housed within layers of thin flexible material, of which the layer that contacts the patient preferably comprises soft, light-absorbing open-celled foam material (26) which is transmissible by water vapor, to dissipate moisture at the patient-sensor interface.
Patent•
14 Aug 1992
TL;DR: In this paper, an anisotropic conductive adhesive is used to connect the electrodes of a flexible printed circuit and a LSI to a circuit board, by which the need for subjecting the electrode 1a of the circuit element to the metallization treatment is eliminated and the inexpensive and high density packaging structure is obtd.
Abstract: PURPOSE:To provide the inexpensive and high-density packaging structure for electronic circuits which allows electrical connection to driving circuits of LSIs, etc., without subjecting the electrodes of the electronic circuit element to a metallization treatment, such as gold plating. CONSTITUTION:The electrode 1a of the electronic circuit element and the electrode 3a of a flexible printed circuit positioned on a circuit board 4 are connected by an anisotropic conductive adhesive 5. The electrode 3a of the flexible printed circuit and the electrode 2a of the LSI positioned on the flexible printed circuit or the circuit board 4 as well as the electrode 2a of the LSI and the electrode 3a of the circuit board are respectively connected by wire bonding, by which the need for subjecting the electrode 1a of the electronic circuit element to the metallization treatment is eliminated and the inexpensive and high- density packaging structure is obtd.
Patent•
03 Jun 1992
TL;DR: In this article, a flexible printed circuit board comprises target marks provided near ends 4 required to be accurately punched of products 5 of the board, and a method for manufacturing the board comprises the steps of detecting centers of the marks by using a special measuring camera, sequentially punching as 2, 3 by multi-punches, and then punching an entire outer periphery of the product.
Abstract: PURPOSE: To flexible printed circuit more accurately than in the prior art to engage ends with a narrow pitch type connector in order to separate one by one a plurality of products formed simultaneously by punching in a flexible printed circuit board. CONSTITUTION: A flexible printed circuit board comprises target marks 1 provided near ends 4 required to be accurately punched of products 5 of the board. A method for manufacturing the board comprises the steps of detecting centers of the marks by using a special measuring camera, sequentially punching as 2, 3 by multi-punches, and then punching an entire outer periphery of the product. COPYRIGHT: (C)1994,JPO&Japio
Patent•
31 Aug 1992
TL;DR: In this article, a flexible printed circuit (FPC) is proposed to provide a flexibility which can respond to a composite substrate or a stepped substrate and to enable packaging of small size and high density by providing connection electrode pads of a semiconductor device with a plurality of bump electrodes different in height.
Abstract: PURPOSE:To provide a flexibility which can respond to a composite substrate or a stepped substrate and to enable packaging of small size and high density by providing connection electrode pads of a semiconductor device with a plurality of bump electrodes different in height. CONSTITUTION:A connection electrode 12 is arranged on the surface of a substrate 11, and this connection electrode 12 is connected to a flexible printed circuit(FPC)13 as the input-output signal bus line by means of an anisotropic conductive film 14. The FPC 13 consists of an insulating layer 13b and connection wiring layers 13a, 13c formed on both faces of this insulating layer 13b. Further, solder on the tip 25b of a bump electrode 25 of a semiconductor device 2 of bump electrodes different in height is melted to connect a semiconductor chip 21 having bump electrodes 25 to the connection electrode 21 and the FPC 13 on the substrate 11. Therefore, this can respond to steps developed by mounting other components on the substrate and enables small-sized, high-density packaging. It is possible to make not only packaging on the substrate surface, but also further connection from above components packaged on the substrate.
Patent•
08 Jan 1992
TL;DR: In this article, the authors used polyimide powder added to a high-temperature resin having the same composition as a base as a flexibility dative agent, as the cover coat of the board for a flexible printed circuit.
Abstract: PURPOSE:To improve the heat resistance of a circuit board particularly by using a high-temperature resin, in which polyimide powder is added to a high- temperature resin having the same composition as a base as a flexibility dative agent, as the cover coat of the board for a flexible printed circuit. CONSTITUTION:Polyimide obtained by heating and curing a polyamic acid mixed solution (C) acquired by mixing and agitating a polyamic acid solution (A), which is obtained by reacting a 3,3',4,4'-biphenyl tetracarboxylic acid bianhydride and paraphenylenediamine, and a polyamic acid solution (S), which is acquired by reacting a pyromellitic acid bianhydride and 4,4'-diaminodiphenyl ether, at the rate of A/B=55/45-75/25 when a tetracarboxylic acid bianhydride component and a diamine component are reacted while acidic component/amine component (a mol ratio) is brought to 0.90-1.00 is used as a high-temperature resin. Polyimide powder acquired by reacting a 3,3',4,4'-biphenyl tetracarboxylic acid bianhydride and diphenylmethane isocyanate is employed as a flexibility dative agent, and added at 1-40wt.%.
Patent•
01 Sep 1992TL;DR: Flexible PCB (I) as discussed by the authors consists of a first layer (104) of insulating material extending over one part of the length of the circuit board, and at least one conducting path (102) of conducting material arranged between the first layer and the second layer.
Abstract: Flexible PCB (I) comprises (a) a first layer (104) of insulating material extending over one part of the length of the circuit board; (b) a second layer (106) of insulating material extending over one part of the length of circuit board; (c) at least one conducting path (102) of conducting material arranged between the first layer (106) and the second layer (104); and (d) a bent section extending over one part of the length of the flexible circuit board and having a lower stiffness than sections of the circuit board boardering the bent section. (I) is produced by (i) arranging an average layer comprising a conducting path (102) between two layers (104,106) to form the board (100 and (ii) forming a bending section in the flexible PCB. ADVANTAGE - By reducing the moment of inertia of the bending section, the bending moment is decreased.
Patent•
19 Mar 1992TL;DR: In this article, the daughter circuit board is inserted into the reception socket of the main circuit board and the flexible circuit is moved relative to the main board into a position in which the corresp. contacts are connected via a cam (28) and a cooperating tensioning device (38).
Abstract: The connector allows the electrical contacts along the edge of the daughter circuit board (12) to be angled to the electrical contacts of the main circuit board (10) via a flexible circuit (54) housed within a reception socket (16a, 16b) for the edge of the daughter circuit board. The flexible circuit is moved relative to the main circuit board into a position in which the corresp. contacts are connected via a cam (28) and a cooperating tensioning device (38) upon insertion of the daughter circuit board in the reception socket. ADVANTAGE - High flexibility and compactness.
Patent•
11 Mar 1992
TL;DR: In this article, a method of manufacturing a two-layer TAB tape, wherein predetermined opening parts are provided in a semicured polyamic acid film or the one subjected to 10 % or more drawing which is formed on a release film, either of them is contact-bonded to a conductor foil or a semicure light-transmitting polyamid acid film formed on conductor film, the film or films are changed to imide, and a desired pattern is formed in the conductor foil.
Abstract: A method of manufacturing a two-layer TAB tape, wherein predetermined opening parts are provided in a semicured polyamic acid film or the one subjected to 10 % or more drawing which is formed on a release film, either of them is contact-bonded to a conductor foil or a semicured light-transmitting polyamic acid film formed on a conductor film, the film or films are changed to imide, and a desired pattern is formed in the conductor foil. Methods of manufacturing 10 % or more drawn polyamic acid film, flexible printed circuit boards using this film, and flexible printed circuit boards with cover-lays are also disclosed.
Patent•
09 Mar 1992
TL;DR: In this article, a base plate and a flexible printed circuit board patterned to a coil shape with a conductor on the surface respectively on one main plane were integrated to reduce the cost of production.
Abstract: PURPOSE:To reduce the cost of production by joining a base plate and a flexible printed circuit board patterned to a coil shape with a conductor on the surface respectively on one main plane, thereby integrating the base plate and the circuit board CONSTITUTION:The base plate 8 and the flexible printed circuit board 1 formed with the coil 4 by patterning a conductor layer 3 on the surface of the coil shape are respectively joined on one main surface Since the coil 4 is formed by the flexible printed circuit board 1 in such a manner, terminals 6 extending from the coil 4 are eventually formed on the circuit board 1 and the later joining to external lead wires is facilitated In addition, the need for freshly adding working in order to connect the external lead wires is eliminated The process for production is thus simplified and the cost of production is reduced
Patent•
10 Jul 1992
TL;DR: In this paper, a flexible printed circuit board for memory card interfaces is proposed to attain miniaturization and thinning by heightening a degree of freedom for design by connecting a memory card connector to a control circuit board.
Abstract: PURPOSE:To attain miniaturization and thinning by heightening a degree of freedom for design by connecting a connector for memory card to a control circuit board for memory card interface via a flexible printed circuit board. CONSTITUTION:The connector 11 for memory card is connected to the control circuit board for memory card interface via the flexible printed circuit board 17. Also, the flexible printed circuit board 17 is formed to one terminal of which a socket 18 that is a connector connected to a pin 14 in such a way that it can be connected/disconnected is fixed, and also, on the surface of which a signal line 19 is formed. Thereby, it is possible to arrange the connector 11 for memory card at an arbitrary position, and to attain the miniaturization and the thinning by heightening the degree of freedom in the design, and to simplify connection structure.
Patent•
04 Dec 1992
TL;DR: In this paper, the authors proposed a method to obtain a high quality product by a method wherein a cushion material formed by stacking a sheet of kraft paper on a cushion layer is used in such a way that an overlay film is brought into contact with the mold-release face of the cushion layer.
Abstract: PURPOSE:To obtain a high-quality product by a method wherein a cushion material formed by stacking a sheet of kraft paper on a cushion layer is used in such a way that an overlay film is brought into contact with the mold- releasing face of the cushion layer. CONSTITUTION:A circuit is formed on the surface of a copper-clad laminated board; after that, the circuit is covered with an overlay film. Then, a cushion layer 2 which is composed of, e.g. propylene-based resin sheets 3 is stacked on the surface of the overlay film. In addition, in a state that a sheet of kraft paper 1 has been stacked on the surface of the cushion layer 2, the overlay film and the copper-clad laminated board are heated and pressurized. A sheet of neutral virgin paper which does not discolor the surface of copper for a flexible printed circuit(FPC) is suitable for the sheet of kraft paper; in addition, the sheet of neutral virgin paper whose content of an organic binder such as tar or the like is small is suitable. Thereby, it is possible to obtain the high- quality FPC from which the adhesive of the overlay film oozes little.
Patent•
04 Aug 1992
TL;DR: In this article, a manufacturing method of a flexible substrate and rigid/flexible board of a multi-layer structure for dissolving various problems accompanying thermal expansion and a board manufactured by the method is presented.
Abstract: PURPOSE: To provide a manufacturing method of a flexible substrate and rigid/ flexible board of a multi-layer structure for dissolving various problems accompanying thermal expansion and a board manufactured by the method CONSTITUTION: A pair of conductor layers composed of a flexible material are provided on both parts of the rigid part and flexible part of a device and a conductor pattern is formed on the conductor layer Thereafter, a flexible non-conductive film layer is adhered to the pattern conductor layer of the flexible part by using a flexible adhesive material The conductor pattern of a rigid material is formed by using image formation processing and etching processing techniques Then, the rigid material can be removed from the flexible part of the device An adhesive material used for laminating a flexible layer on a multi-layer flexible board and laminating a rigid layer and the flexible layer to the rigid/flexible substrate is removed from the flexible part of the device and flexibility is supplied to the flexible part Then, a through-hole is made on a structure body and the plating of a connection conductor material is executed to the inside of the through-hole
Patent•
17 Apr 1992
TL;DR: In this paper, the telephone set is made thin in profile and light in its weight by mounting a switch panel which is formed with ink film except a part corresponding to an LCD display section on the surface of a transparent resin plate having plural holes to be inserted with projections, onto a key top sheet.
Abstract: PURPOSE:To make the telephone set thin in its profile and light in its weight by mounting a switch panel which is formed with ink film except a part corresponding to an LCD display section on the surface of a transparent resin plate having plural holes to be inserted with projections, onto a key top sheet CONSTITUTION:An upper case 4 is provided with a support base 4a of a flexible printed circuit board 8, a support base 4b for an LCD 12 and a reception section 4c in the inside of which an earpiece is built in The LCD 12 is mounted on the flexible printed circuit board 8 and a back light use LED 18 is provided to the lower side of the LCD 12 A key top sheet 24 is formed by connecting a projection 24a and a contact support part 24b with a skirt 24c and the projection 24a is inserted into a hole 27 of a switch panel 26 made of a transparent resin An ink film 28 is formed to the upper face of the switch panel 26
Patent•
11 Sep 1992
TL;DR: In this article, a hair-pin-shaped bent portion of a flexible printed circuit board with another flexible printed board or a rigid printed board is used to adhere to each other.
Abstract: PURPOSE:To provide a pressing member which is capable of combining a hair- pin shaped bent portion of a flexible printed circuit board with another flexible printed board or a rigid printed board so as to adhere to each other, because an adhesive or an adhesive double coated tape is commonly used in combining the hair-pin shaped bent portion of the flexible printed board with the rigid printed circuit board or another flexible printed board, which leads to the operating efficiency being considerably impaired CONSTITUTION:A pressing member 3 pinches a hair-pin shaped bent portion of a flexible printed circuit board 1 as shown in the drawing, so that the board 1 is adhered to the surface of a rigid printed board 2b, whereby the boards 1 and 2 are combined with each other The use of the pressing member 3 improves the operating efficiency to a much greater extent