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Showing papers by "Adisorn Tuantranont published in 1999"


Proceedings ArticleDOI
10 Mar 1999
TL;DR: In this paper, a flip chip integration of microlens arrays with surface micromachined segmented deformable micromirrors is presented, where the use of a lenslet to focus the incoming laser beam onto the reflective surface of a microromirror substantially increases optical efficiency of the hybrid microsystem.
Abstract: Flip chip assembly technology offers a reliable and advanced packaging approach for hybrid integration of micromachined optical components. In this paper we present flip chip integration of microlens arrays with surface micromachined segmented deformable micromirrors. 12 by 12 electrostatic micromirror arrays were fabricated through a commercial surface micromachining process and integrated with glass microlenses. A commercial glass microlens array is positioned directly over the micromirror. The use of a lenslet to focus the incoming laser beam onto the reflective surface of a micromirror substantially increases optical efficiency of the hybrid microsystem. For mirror deflections much smaller than the lenslet focal length, the lenslet/micromirror combination behaves as a phase-only modulating optical element. The hybrid lenslet/MEMS arrays thus serve as rugged, compact optical elements for beam steering, beam shaping, and aberration correction applications.

32 citations


Proceedings ArticleDOI
02 Sep 1999
TL;DR: In this article, a lenslet integrated Micro-Electro-Mechanical Deformable Micromirrors (LMEM-DMs) are used to focus the incoming laser beam onto the reflective surface of a micromirror.
Abstract: Lenslet integrated Micro-Electro-Mechanical Deformable Micromirrors (LMEM-DMs) are electrostatic micromirror arrays fabricated through a commercial surface micromachining process and integrated with polymer or glass microlenses. The electronics resins (Photo-BCB) which are photo-sensitive polymers were used to fabricate polymer microlens arrays. A 4 X 4 element photo-BCB Cyclotene microlens array was fabricated on a thin quartz substrate. Self-aligned soldering flip-chip assembly is applied to integrate microlens arrays directly over the micromirrors. The lens/mirror gap is controlled using the final height of solder balls, and the lateral alignment is achieved by the solder self-aligning mechanism. The LMEM-DM is attractive due to its low cost and the low drive voltages. The use of a lenslet to focus the incoming laser beam onto the reflective surface of a micromirror substantially increases overall optical fill factor of the micromirror array. The LMEM-DM provides superior aberration correction with low residual diffraction effects. For mirror deflections much smaller than the lenslet focal length, the LMEM-DM behaves as a phase-only modulating optical element. The LMEM-DM thus serves as a rugged, compact optical element for beam steering, beam shaping, and aberration correction applications.

19 citations


Proceedings ArticleDOI
08 Nov 1999
TL;DR: In this article, the use of solder self-alignment to assemble novel three-dimensional MEMS and package MEMS with other optical devices with precision alignment is discussed, and hundreds or thousands of precision alignments can be accomplished with a single batch reflow process, and the cost/alignment can be reduced by orders of magnitude.
Abstract: This paper discusses the use of solder self-alignment to assemble novel three-dimensional MEMS and package MEMS with other optical devices with precision alignment. Soldering is a predominant technology for electronics assembly, and is being developed for optoelectronic passive alignment. Using solder, hundreds or thousands of precision alignments can be accomplished with a single batch reflow process, and the cost/alignment can be reduced by orders of magnitude.

7 citations


Proceedings ArticleDOI
30 Apr 1999
TL;DR: In this article, a packaging technology was developed to integrate a lenslet array with surface micromachined segmented deformable micromirrors, and the spacing control was achieved using a glass spacer, and lateral alignment was achieved by the use of an interferometric microscope.
Abstract: A packaging technology has been developed to integrate a lenslet array with surface micromachined segmented deformablemicromirrors. 12x12 electrostatic micromirror arrays were fabricated through a commercial surface micromachining processand integrated with glass microlenses positioned directly over the micromirror. Control of the spacing and the lateralalignment between the lenslet array and the micromirrors was important for effective fill factor. The spacing control wasaccomplished using a glass spacer, and the lateral alignments were achieved by the use of an interferometric microscope.Measured results of the micromirrors' optical performance demonstrated the success of the packaging technology. 1. INTRODUCTION Micro-electro-mechanical systems (MEMS) offer a novel and cost effective device technology for controlling and compensating the phase of a propagating optical wave front' . With such a control, it is possible to correct aberrations inoptical systems, control the shape of a focused laser beam, and redirect the laser beam. Possible scientific applicationsinclude real time active optical wave front control for correcting atmospheric turbulence effects for astronomy and space

7 citations