Yung-Cheng Lee

TL;DR: Al( 2)O(3) and TiO(2) atomic layer deposition (ALD) were employed to develop an ultrathin barrier film on copper to prevent water corrosion and were found to be much more resilient to dissolution in water and prevented the water corrosion of copper.

TL;DR: 3-D porous anodic alumina template-assisted electrodeposition of Ni followed by TiO(2) coating using atomic layer deposition paves the way to build reliable 3-D nanostructured electrodes for high areal capacity microbatteries.

TL;DR: In this article, a stable and efficient jumping droplet condensation on a superhydrophobic surface with three-dimensional (3D) copper nanowire networks was demonstrated for the first time.

TL;DR: In this paper, a two-level hierarchical surface with patterned copper nanowire arrays for boiling heat transfer enhancement is developed, where microcavities are formed between short nanowires.

TL;DR: In this article, the relative importance of various effects on particle motion was assessed in the context of thermal plasma processing of materials, and the results indicated that the correction term required for the viscous drag coefficient due to strongly varying properties is the most important factor; non-continuum effects are important for smaller particles and/or reduced pressures.