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Alexander E. Andreev

Researcher at LSI Corporation

Publications -  210
Citations -  4595

Alexander E. Andreev is an academic researcher from LSI Corporation. The author has contributed to research in topics: Routing (electronic design automation) & Boolean function. The author has an hindex of 36, co-authored 209 publications receiving 4581 citations. Previous affiliations of Alexander E. Andreev include Avago Technologies & Moscow State University.

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Patent

Advanced modular cell placement system

TL;DR: In this article, a system for determining an affinity associated with relocating a cell located on a surface of a semiconductor chip to a different location on the surface is described, where each cell may be part of a cell net containing multiple cells.
Patent

Metal layer assignment

TL;DR: In this paper, a routing description that includes connection segments and a vertex where at least two of the connection segments connect to each other is obtained, and a penalty is determined for the vertex based on a potential layer assignment combination for the connect segments that connect at the vertex, and routing layers are assigned to the connected segments based on the determined penalty.
Patent

CAD for hexagonal architecture

TL;DR: In this paper, a tri-directional three-layer metal routing scheme is proposed for hexagonal-shaped cells, where the conductors for interconnecting terminals of microelectronic cells are angularly displaced from each other by 60°.
Patent

Advanced modular cell placement system with overlap remover with minimal noise

TL;DR: In this article, a method for refining the position of linearly aligned cells on the surface of a semiconductor chip is presented, which consists of defining an array of spaces between cells based on maximum and minimum cell positions, establishing a minimum spacing between cells, and linearly shifting cells in a predetermined manner such that no cells are closer to one another than the minimum space between cells.
Patent

Hexagonal field programmable gate array architecture

TL;DR: In this article, a tri-directional three-layer metal routing is proposed for hexagonal-shaped cells, where the conductors for interconnecting terminals of microelectronic cells of an integrated circuit prefer to be angularly displaced from each other.