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Andrew J. Bayba
Researcher at United States Army Research Laboratory
Publications - 15
Citations - 417
Andrew J. Bayba is an academic researcher from United States Army Research Laboratory. The author has contributed to research in topics: Thermal resistance & Gallium nitride. The author has an hindex of 8, co-authored 15 publications receiving 349 citations.
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Thermal resistance calculation of AlGaN-GaN devices
TL;DR: In this paper, an accurate closed-form expression for the thermal resistance of a multifinger AlGaN-GaN high electron-mobility transistor (HEMT) device on a variety of host substrates including SiC, Si, and sapphire, as well as the case of a single-crystal GaN wafer.
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Accurate determination of thermal resistance of FETs
TL;DR: In this article, an accurate closed-form expression for the thermal resistance of multifinger FET structures is presented based on the solution of Laplace's equations in prolate spheroidal coordinates and elliptical cylinder coordinates, which is verified by comparing the results with finite-element simulations, and experimental observations from liquid-crystal measurements and spatially resolved photoluminescence measurements.
Journal ArticleDOI
Channel Temperature Analysis of GaN HEMTs With Nonlinear Thermal Conductivity
TL;DR: In this article, an enhanced, closed-form expression for the thermal resistance, and thus, the channel temperature of AlGaN/gallium nitride (GaN) HEMTs, including the effect of the temperature-dependent thermal conductivity of GaN and SiC or Si substrates, is presented.
Journal ArticleDOI
Utilizing Diode Characteristics for GaN HEMT Channel Temperature Prediction
TL;DR: In this article, the Schottky gate-diode forward characteristics were used to estimate channel temperature in GaN high-electron mobility transistors (HEMTs) and compared with results of simulation, theory, and experimental evidence.
Proceedings ArticleDOI
Manifold Microchannel Cooler for Direct Backside Liquid Cooling of SiC Power Devices
Lauren Everhart,Nicholas R. Jankowski,Bruce Geil,Andrew J. Bayba,Dimeji Ibitayo,Patrick McCluskey +5 more
TL;DR: In this article, a manifold microchannel cooler was developed based on single phase liquid forced convection flow, which is targeted at cooling small, high power SiC devices which are seeing increased use because of their fast switching speed and higher reverse bias breakdown voltage.