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Bei Peng

Researcher at University of Electronic Science and Technology of China

Publications -  95
Citations -  3577

Bei Peng is an academic researcher from University of Electronic Science and Technology of China. The author has contributed to research in topics: Capacitive sensing & Diamond. The author has an hindex of 19, co-authored 91 publications receiving 3203 citations. Previous affiliations of Bei Peng include Northwestern University.

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Transient thermal model of a permanent magnet synchronous planar motor considering spreading thermal resistance

TL;DR: In this paper, a thermal resistance network model is proposed to investigate the transient temperature field of PMSP motors, and the effect of thermal resistance and thermal capacitance on the maximum temperature rise is also investigated.
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Modeling the Microstructure Curvature of Boron-Doped Silicon in Bulk Micromachined Accelerometer.

TL;DR: Observations of five groups of proof mass blocks of accelerometers suggest that the theoretical model is effective in determining the buckling value of a fabricated structure.
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The Insertion Mechanism of a Living Cell Determined by the Stress Segmentation Effect of the Cell Membrane during the Tip-Cell Interaction.

TL;DR: According to the experimental and numerical studies, the hypothesis of the stress segmentation effect also explains the reason that modifying the cell membrane or using the manmade sharpened nanotip can increase the insertion efficiency.
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An analysis of the membrane deflection experiment used in the investigation of mechanical properties of freestanding submicron thin films

TL;DR: In this article, the competition between different failure mechanisms (stretching, bending and curvature localization) in freestanding submicron thin films commonly used in microelectromechanical systems was investigated.
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Electrostatic compensation method in frequency robustness design of micro accelerometer

TL;DR: In this article, an electrostatic compensation method is proposed to realize the frequency robustness of a capacitive accelerometer by taking advantage of the electromechanical coupling characteristics, rather than mechanical structure alone.