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Bei Peng
Researcher at University of Electronic Science and Technology of China
Publications - 95
Citations - 3577
Bei Peng is an academic researcher from University of Electronic Science and Technology of China. The author has contributed to research in topics: Capacitive sensing & Diamond. The author has an hindex of 19, co-authored 91 publications receiving 3203 citations. Previous affiliations of Bei Peng include Northwestern University.
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Investigation of the Thermal Drift of MEMS Capacitive Accelerometers Induced by the Overflow of Die Attachment Adhesive
TL;DR: In this paper, the authors investigated the contribution of adhesive overflow to the thermal drift of comb MEMS capacitive accelerometers with different levels of overflow to study the deformation of sensitive component induced by temperature change.
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Epitaxially influenced boundary layer model for size effect in thin metallic films
TL;DR: In this article, it was shown that the size effect in pure tension tests on free thin metallic films can be explained by the existence of a boundary layer of fixed thickness, located at the surface of the film that was attached onto the substrate during deposition.
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Prediction of Gap Asymmetry in Differential Micro Accelerometers
TL;DR: The prediction methodology combines the measurement results and analytical derivation to identify the asymmetric error of 30 accelerometers fabricated by DRIE, and indicates that the level of asymmetry induced by fabrication uncertainty is about ±5 × 10−2, and that the absolute error is about±0.2 μm under a 4 μm gap.
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Numerical Investigation of the Fracture Mechanism of Defective Graphene Sheets.
TL;DR: The fracture of the graphene sheet was developed following the direction of the breaking of carbon–carbon bonds, which was opposite to that of the displacement loading, demonstrating that all four types of defects could cause significant fracture strength loss in graphene sheet compared with the pristine one.
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Material Viscoelasticity-Induced Drift of Micro-Accelerometers
TL;DR: The accelerometer experienced output drift due to the development of packaging stress induced by both the thermal mismatch and viscoelastic behaviors of the adhesive, and the drift level of accelerometers experiencing high temperature load was relatively higher than those of lower temperature in the same period.