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Bin Shi

Researcher at Eindhoven University of Technology

Publications -  17
Citations -  145

Bin Shi is an academic researcher from Eindhoven University of Technology. The author has contributed to research in topics: Photonics & Optical amplifier. The author has an hindex of 4, co-authored 17 publications receiving 57 citations.

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Journal ArticleDOI

Deep Neural Network Through an InP SOA-Based Photonic Integrated Cross-Connect

TL;DR: A comprehensive analysis of the error evolution in the system reveals that the electrical/optical conversions dominate the error contribution, which suggests that an all optical approach is preferable for future neuromorphic computing hardware design.
Journal ArticleDOI

Neuromorphic Photonics: 2D or not 2D?

TL;DR: A novel three-dimensional computational unit is proposed, with its compactness, ultrahigh efficiency, and lossless interconnectivity, is foreseen to allow scalable computation AI chipsets that outperform electronics in computational speed and energy efficiency to shape the future of neuromorphic computing.
Proceedings ArticleDOI

Lossless Monolithically Integrated Photonic InP Neuron for All-Optical Computation

TL;DR: A monolithically integrated SOA-based photonic neuron is demonstrated, including both the weighted addition and a wavelength converter with tunable laser as nonlinear function, allowing for lossless computation of 8 Giga operation/s with an 89% accuracy.
Proceedings ArticleDOI

WDM Weighted Sum in an 8x8 SOA-Based InP Cross-Connect for Photonic Deep Neural Networks

TL;DR: High fidelity weighted addition of four 10 Gb/s on-off keyed data channels on a SOA-based monolithically integrated cross-connect, with a reading error dispersion below 0.2, opens the route to feasible 8x8 one-layer neuron interconnectivity for photonic integrated deep neural networks.
Proceedings ArticleDOI

Image Classification with a 3-Layer SOA-Based Photonic Integrated Neural Network

TL;DR: Iris flowers classification is demonstrated for the first time by implementing a trained 3-layer neural network with an SOA-based InP cross-connect chip with accuracy 9.2% lower than what obtained via a computer.