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Bin Xu

Researcher at Chinese Academy of Sciences

Publications -  57
Citations -  588

Bin Xu is an academic researcher from Chinese Academy of Sciences. The author has contributed to research in topics: Microstructure & Grain boundary. The author has an hindex of 9, co-authored 38 publications receiving 213 citations.

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Dissolution and evolution of interfacial oxides improving the mechanical properties of solid state bonding joints

TL;DR: In this paper, the authors reported a method to completely heal solid state bonding joints with recovered mechanical properties by hot compression bonding and post-holding treatment, which is attributed to the dissolution and evolution of the interfacial oxides.
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Ultrafine-grained dual-phase maraging steel with high strength and excellent cryogenic toughness

TL;DR: In this article, a novel heat treatment route consisting of a low-temperature solution followed by an over-aging treatment at 500 °C is proposed to develop a high-strength, high-cryogenic-toughness maraging steel by forming an ultrafine-grained martensite (α′) and austenite (γ) dual-phase microstructure.
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Interfacial microstructure evolution and bonding mechanisms of 14YWT alloys produced by hot compression bonding

TL;DR: In this article, Zhao et al. used electron backscattered diffraction and transmission electron microscopy to study the evolution of hot deformed microstructures of 14YWT steels.
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Evolution of the interfacial microstructure during the plastic deformation bonding of copper

TL;DR: In this paper, the microstructural evolution of the copper-copper interface by hot compression was investigated in detail, and the development of new recrystallized grains in the bonding area and the elimination of the bonding line by the migration of interfacial grain boundaries (IGBs) during the hot compression process.
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Oxidation of stainless steel in vacuum and evolution of surface oxide scales during hot-compression bonding

TL;DR: In this paper, the oxidation behavior of austenite stainless steel in vacuum and the evolution of oxide scales during vacuum hot-compression bonding were investigated combining XPS and TEM.