The thermal‐oxidation kinetics of silicon are examined in detail. Based on a simple model of oxidation which takes into account the reactions occurring at the two boundaries of the oxide layer as well as the diffusion process, the general relationship x02+Ax0=B(t+τ) is derived. This relationship is shown to be in excellent agreement with oxidation data obtained over a wide range of temperature (700°–1300°C), partial pressure (0.1–1.0 atm) and oxide thickness (300–20 000 A) for both oxygen and water oxidants. The parameters A, B, and τ are shown to be related to the physico‐chemical constants of the oxidation reaction in the predicted manner. Such detailed analysis also leads to further information regarding the nature of the transported species as well as space‐charge effects on the initial phase of oxidation.

General Relationship for the Thermal Oxidation of Silicon

Learn the basic properties and designs of modern VLSI devices, as well as the factors affecting performance, with this thoroughly updated second edition. The first edition has been widely adopted as a standard textbook in microelectronics in many major US universities and worldwide. The internationally-renowned authors highlight the intricate interdependencies and subtle tradeoffs between various practically important device parameters, and also provide an in-depth discussion of device scaling and scaling limits of CMOS and bipolar devices. Equations and parameters provided are checked continuously against the reality of silicon data, making the book equally useful in practical transistor design and in the classroom. Every chapter has been updated to include the latest developments, such as MOSFET scale length theory, high-field transport model, and SiGe-base bipolar devices.

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Fundamentals of Modern VLSI Devices

In the past several years, research in each of the wide‐band‐gap semiconductors, SiC, GaN, and ZnSe, has led to major advances which now make them viable for device applications. The merits of each contender for high‐temperature electronics and short‐wavelength optical applications are compared. The outstanding thermal and chemical stability of SiC and GaN should enable them to operate at high temperatures and in hostile environments, and also make them attractive for high‐power operation. The present advanced stage of development of SiC substrates and metal‐oxide‐semiconductor technology makes SiC the leading contender for high‐temperature and high‐power applications if ohmic contacts and interface‐state densities can be further improved. GaN, despite fundamentally superior electronic properties and better ohmic contact resistances, must overcome the lack of an ideal substrate material and a relatively advanced SiC infrastructure in order to compete in electronics applications. Prototype transistors have been fabricated from both SiC and GaN, and the microwave characteristics and high‐temperature performance of SiC transistors have been studied. For optical emitters and detectors, ZnSe, SiC, and GaN all have demonstrated operation in the green, blue, or ultraviolet (UV) spectra. Blue SiC light‐emitting diodes (LEDs) have been on the market for several years, joined recently by UV and blue GaN‐based LEDs. These products should find wide use in full color display and other technologies. Promising prototype UV photodetectors have been fabricated from both SiC and GaN. In laser development, ZnSe leads the way with more sophisticated designs having further improved performance being rapidly demonstrated. If the low damage threshold of ZnSe continues to limit practical laser applications, GaN appears poised to become the semiconductor of choice for short‐wavelength lasers in optical memory and other applications. For further development of these materials to be realized, doping densities (especially p type) and ohmic contact technologies have to be improved. Economies of scale need to be realized through the development of larger SiC substrates. Improved substrate materials, ideally GaN itself, need to be aggressively pursued to further develop the GaN‐based material system and enable the fabrication of lasers. ZnSe material quality is already outstanding and now researchers must focus their attention on addressing the short lifetimes of ZnSe‐based lasers to determine whether the material is sufficiently durable for practical laser applications. The problems related to these three wide‐band‐gap semiconductor systems have moved away from materials science toward the device arena, where their technological development can rapidly be brought to maturity.

Large‐band‐gap SiC, III‐V nitride, and II‐VI ZnSe‐based semiconductor device technologies

The development of an ion-sensitive solid-state device is described. The device combines the principles of an MOS transistor and a glass electrode and can be used for measurements of ion activities in electrochemical and biological environments. Some preliminary results are given.

Development of an Ion-Sensitive Solid-State Device for Neurophysiological Measurements

The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

http://science.sciencemag.org/content/sci/311/5758/208.full.pdf

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

The nature of the surface-state charge (Qss) associated with thermally oxidized silicon has been studied experimentally using MOS structures. The effects of oxidation conditions, silicon orientation, annealing treatments, oxide thickness, and electric field were examined, as well as the physical location of the surface-state charge. The results indicate that the surface-state charge can be reproducibly controlled over a range 1010-1012 cm -2, and that it is an intrinsic property of the silicon dioxide-silicon system. It appears to be due to an excess silicon species introduced into the oxide layer near the silicon during the oxidation process.

Characteristics of the Surface‐State Charge (Qss) of Thermally Oxidized Silicon

Interface states and electron spin resonance centers have been observed and compared in thermally oxidized (111) and (100) silicon wafers subjected to various processing treatments. The ESR Pb signal, previously assigned to interface ⋅Si≡Si3 defects on (111) wafers, was found to have two components on (100): an ⋅Si≡Si3 center oriented in accord with (100) face structure, and an unidentified center consistent with ⋅Si≡Si2O. The quantitative proportionality of Pb spin concentration to midgap interface trap density Dit is maintained on (100), and both are lower by a factor of about 3 compared to (111). This correlation persists over the range of oxidation temperatures 800–1200°C, for both n‐ and p‐doped silicon, cooled by fast pull in oxygen, and cooled or annealed in nitrogen or argon. The correlation is independent of doping level. In samples with different oxide thickness, neither Pb nor Dit varied significantly over the range 100–2000 A, but Pb was smaller at 50 A. In general, ESR is judged to offer prom...

Interface states and electron spin resonance centers in thermally oxidized (111) and (100) silicon wafers

It is shown that changes in the capacitance‐voltage characteristic of a metal‐insulator‐semiconductor structure provide a powerful tool for the observation of ion motion in thin insulating films. Using this method, a detailed study of the kinetics of alkali ion migration in thermally grown silicon dioxide films has been made. Alkali ions were initially deposited at the metal‐oxide interface and their transport through the oxide was studied as a function of time, temperature and applied voltage. When the metal is biased positively the number of ions accumulated at the oxide‐silicon interface is initially proportional to the square root of time and then approaches a saturation value. The temperature dependence is exponential and leads to an activation energy for the diffusion coefficient of 32 kcal/mole for Na and 22 kcal/mole for Li.A simple model is developed which is based on the division of the insulator into two regions: a thin boundary layer near the metal‐insulator interface in which ion transport is...

Ion Transport Phenomena in Insulating Films

The ESR Pb center has been observed in thermally oxidized single‐crystal silicon wafers, and compared with oxide fixed charge Qss and oxidation‐induced interface states Nst. The Pb center is found to be located near the interface on (111) wafers. Its g anisotropy is very similar to that of known bulk silicon defects having SiIII bonded to three other Si atoms; the Pb unpaired electron orbital, however, is exclusively oriented normal to the (111) surface. The Pb center cannot be identified with any other known defect in Si or SiO2; in particular, it is totally unlike the common E′ center of SiO2. In contrast to Qss, both Pb and Nst were found to be greatly reduced by steam oxidation and hydrogen annealing. Both Pb and Nst may be regenerated by subsequent N2 anneals at 500 °C. In a graded series of samples, Pb and Nst are found to be proportional and nearly equal in concentration. This possible confirmation of SiIII at the interface, and correlation with Nst, support the theoretical indication of an SiIII b...

Bruce E. Deal

Papers

General Relationship for the Thermal Oxidation of Silicon

Characteristics of the Surface‐State Charge (Qss) of Thermally Oxidized Silicon

Interface states and electron spin resonance centers in thermally oxidized (111) and (100) silicon wafers

Ion Transport Phenomena in Insulating Films

ESR centers, interface states, and oxide fixed charge in thermally oxidized silicon wafers