Chia-Hao Tsai

TL;DR: In this article, a robust methodology composed of a mechanical model of multi-thin film under bending loads and related stress simulations based on nonlinear finite element analysis (FEA) is proposed, and validated to be more reliable compared with related experimental data.

TL;DR: In this paper, the authors introduced two important types of testing loads (i.e., entire reverse of bend and torsion with several cycles) to investigate the optical and flexible characteristics of film-type cholesteric liquid crystal displays (ChLCDs).

TL;DR: In this article, the authors employed the four-point bending test (4-PBT) to measure the interfacial strength of pressure-sensitive adhesive (PSA)/SiN passivation stacked thin films.

TL;DR: In this paper, a model of multi-layer under bending loadings and related stress simulations, based on finite element method (FEM), is proposed to analyze the stress/strain characteristic of flexible packaging with organic light-emitting diode (OLED) devices under various geometrical combinations of stacked thin films and plastic substrate.

TL;DR: In this article, a nonlinear finite element analysis combined with the approach of full factorial design is performed to explore several concerned mechanical parameters within a whole structure and the results reveal that the thickness of PI_substrate is the most dominant to determine the position of neutral axis and the bending stress of indium tin oxide film, separately.