Chong Zhang

TL;DR: In this paper, a transient thermal model is developed to describe the drilling process of microvias with a YAG laser of wavelength 1.06 µm for high density electronic packaging applications, where a fraction of the laser energy is absorbed inside the polymer layer and an overheated small metastable region can form inside the layer.

TL;DR: In this article, a one-dimensional transient heat conduction model including vaporization parameters is constructed to analyze the laser-material interactions in polymeric multilayer electronic substrates, where the laser energy interacts at the substrate surface as well as inside the substrate.

TL;DR: In this article, the authors present techniques and configurations for using projection patterning in making an electronic substrate with an embedded die, where the projected mask pattern may include a via disposed over the die.

TL;DR: In this paper, the authors present a method for depositing an electrically insulative layer on a bridge interconnect structure, which is configured to route electrical signals between a first die and a second die, forming an opening through the sacrificial layer and the electrically-insulative layer to expose the die contact and forming a die interconnect of the first die or the second die by depositing electrically conductive material into the opening.

TL;DR: In this article, a two-dimensional transient heat conduction model including vaporization parameters is constructed to understand the profile of the drilling front irradiated with different laser beam profiles, and the absorption length in the dielectric is also considered in this model.