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Dai Gil Lee

Researcher at KAIST

Publications -  321
Citations -  8595

Dai Gil Lee is an academic researcher from KAIST. The author has contributed to research in topics: Composite number & Epoxy. The author has an hindex of 44, co-authored 321 publications receiving 7620 citations. Previous affiliations of Dai Gil Lee include Samsung Heavy Industries & Chonbuk National University.

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Fracture toughness of the nano-particle reinforced epoxy composite

TL;DR: In this paper, nano-particle additives such as carbon black and nanoclay were mixed with epoxy resin to improve the fracture toughness of fiber-reinforced composites, and they measured the single edge notched bend specimen at the room (25°C) and cryogenic temperature (−150°C).
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Design and manufacture of an automotive hybrid aluminum/composite drive shaft

TL;DR: In this article, a one-piece automotive hybrid aluminum/composite drive shaft was developed with a new manufacturing method, in which a carbon fiber epoxy composite layer was co-cured on the inner surface of an aluminum tube rather than wrapping on the outer surface to prevent the composite layer from being damaged by external impact and absorption of moisture.
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Development of the composite RAS (radar absorbing structure) for the X-band frequency range

TL;DR: In this article, the conductive carbon black with the binder matrix of the E-glass/polyester composite has been used for fabricating the radar absorbing structure (RAS) of desired performance.
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Failure Modes of Foam Core Sandwich Beams under Static and Impact Loads

TL;DR: In this article, the authors describe the use of sandwich structures in load bearing structures due to their high specific stiffness and high specific strength, such as the ones used in this paper.
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Bipolar plate made of carbon fiber epoxy composite for polymer electrolyte membrane fuel cells

TL;DR: In this article, a bipolar plate for automotive fuel cells was developed with carbon fiber composite by compression molding due to the fact that carbon/epoxy composite has not only high electrical and thermal conductivities, but also high specific stiffness and strength.