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Dai Gil Lee

Researcher at KAIST

Publications -  321
Citations -  8595

Dai Gil Lee is an academic researcher from KAIST. The author has contributed to research in topics: Composite number & Epoxy. The author has an hindex of 44, co-authored 321 publications receiving 7620 citations. Previous affiliations of Dai Gil Lee include Samsung Heavy Industries & Chonbuk National University.

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Cryogenic Performance of Adhesively Bonded Metal Joints for LNG Containment System

TL;DR: In this paper, the performance of adhesively bonded joints composed of aluminum sandwich structures and stainless steel foils for LNG (Liquefied Natural Gas) containment system was studied.
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A Closed-form Solution for the Torque Transmission Capability of the Adhesively Bonded Tubular Double Lap Joint

TL;DR: In this paper, an analytic solution for the torque transmission capability and stress distribution of the adhesively bonded tubular double lap joint was derived assuming linear properties of the adhesive, and it was found that the double-lap joint was more than 40% larger than that of the single lap joint.
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Design and manufacture of the composite flexspline of a harmonic drive with adhesive joining

TL;DR: In this paper, anisotropic composite materials have been used to construct a flexible and light-weight harmonic drive for rotational motion transmission, which is composed of a circular spline, a wave generator and a flex spline.
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Thrust bearing design for high-speed composite air spindles

TL;DR: In this article, the axial stiffness and load capability of an air spindle was designed considering the stresses induced by the centrifugal force as well as the natural frequency of rotating shaft to avoid the resonant whip vibration of the spindle.
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Composite sandwich endplates with a compliant pressure distributor for a PEM fuel cell

TL;DR: In this paper, an insulating foam-core composite sandwich structure and a pre-curved compliant pressure distributor are employed for both good insulation performance and uniform pressure distribution on the PEMFC stack.