Daoqiang Lu

TL;DR: In this article, reduced graphene oxide (RGO)-encapsulated SiO2 hybrids (SiO2@RGO) were fabricated from the thermal reduction of electrostatically assembled SiO 2@GO hybrids.

TL;DR: In this article, a hierarchical structure of porous copper microspheres assembled with nanoparticles has been successfully synthesized by ingeniously selecting the precursor and complexant through a facile wet chemical reduction method.

Abstract: Epoxy composites, with boron nitride spheres (s-BN) and flakes (f-BN) as fillers were prepared. The effect of filler morphology, content, and crystallization of BN particles on the thermal conductivity, thermo-mechanical and dielectric properties of the composites were investigated. At the same loading level, s-BN with smaller size and larger surface area led to much more significant increase in the glass transition temperature (T g ), reduction in the coefficient of thermal expansion and lower storage modulus (E′), while much higher thermal conductivities were observed in epoxy composites containing f-BN, owing to the larger aspect ratio and better crystallization. In addition, the introduction of BN fillers only did slightly increase on the dielectric constant and dielectric loss of the epoxy resin. We believe, the BN enhanced epoxy composites, with significantly improved thermal conductivity and thermo-mechanical properties, yet maintaining low dielectric constant and dielectric loss at the same time, have great application potential in the microelectronic insulation industry.

TL;DR: In this article, three kinds of silica nanoparticles with different surface functional groups (amino groups, epoxide groups, and alkyl chain groups) were prepared and used as fillers in the amine-cured epoxy resin systems to investigate the relationship between the interfacial interaction and the rheological and thermal properties of reinforced epoxy nanocomposites.

TL;DR: In this paper, in-situ modification of SiO2 nanoparticles by using organosilanes with different functional groups was conducted, and the structure-property relationships between microscopic surface state of the nano-fillers and macroscopic rheological, coefficient of thermal expansion (CTE) and adhesive properties of the resulting amine curing epoxy-based nanocomposite underfills were demonstrated.