D
David Broido
Researcher at Boston College
Publications - 170
Citations - 16734
David Broido is an academic researcher from Boston College. The author has contributed to research in topics: Phonon & Thermal conductivity. The author has an hindex of 55, co-authored 161 publications receiving 14269 citations. Previous affiliations of David Broido include University of California & United States Naval Research Laboratory.
Papers
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Journal ArticleDOI
Comment on ``Use of quantum well superlattices to obtain high figure of merit from nonconventional thermoelectric materials'' [Appl. Phys. Lett. 63, 3230 (1993)]
David Broido,T. L. Reinecke +1 more
Journal ArticleDOI
Luttinger parameters for GaAs determined from the intersubband transitions in GaAs/Al x Ga 1-x As multiple quantum wells
TL;DR: In this article, a new set of Luttinger parameters were proposed to describe the highly anisotropic nature of the valence band in GaAs and showed that the heavy and light-hole masses along the [111] direction are $075 and $0082{m}_{0}, respectively.
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Lattice thermal conductivity of (Bi 1 − x Sb x ) 2 Te 3 alloys with embedded nanoparticles
TL;DR: In this paper, upper and lower limits for the thermal conductivities that could be obtained via seamlessly embedded spherical nanoparticles as a function of their size, density, and volume fraction were established.
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Holes at GaAs-AlxGa1-xAs heterojunctions in magnetic fields
TL;DR: In this article, the effects of anisotropy of the valence band structure and mixing of the heavy and light holes on the Landau levels of the hole inversion layer in a normal magnetic field are studied.
Journal Article
Temperature-dependent thermal conductivity in silicon nanostructured materials studied by the Boltzmann transport equation
TL;DR: Romano et al. as mentioned in this paper calculated the mean free path distribution in periodic nanoporous Si for different temperatures, using the recently developed MFP-dependent Boltzmann Transport Equation, and found that at room temperature optical phonons contribute 18 % to heat transport, compared to 5% in bulk Si.