Preface to Third Edition. 1 Resistivity. 1.1 Introduction. 1.2 Two-Point Versus Four-Point Probe. 1.3 Wafer Mapping. 1.4 Resistivity Profiling. 1.5 Contactless Methods. 1.6 Conductivity Type. 1.7 Strengths and Weaknesses. Appendix 1.1 Resistivity as a Function of Doping Density. Appendix 1.2 Intrinsic Carrier Density. References. Problems. Review Questions. 2 Carrier and Doping Density. 2.1 Introduction. 2.2 Capacitance-Voltage (C-V). 2.3 Current-Voltage (I-V). 2.4 Measurement Errors and Precautions. 2.5 Hall Effect. 2.6 Optical Techniques. 2.7 Secondary Ion Mass Spectrometry (SIMS). 2.8 Rutherford Backscattering (RBS). 2.9 Lateral Profiling. 2.10 Strengths and Weaknesses. Appendix 2.1 Parallel or Series Connection? Appendix 2.2 Circuit Conversion. References. Problems. Review Questions. 3 Contact Resistance and Schottky Barriers. 3.1 Introduction. 3.2 Metal-Semiconductor Contacts. 3.3 Contact Resistance. 3.4 Measurement Techniques. 3.5 Schottky Barrier Height. 3.6 Comparison of Methods. 3.7 Strengths and Weaknesses. Appendix 3.1 Effect of Parasitic Resistance. Appendix 3.2 Alloys for Contacts to Semiconductors. References. Problems. Review Questions. 4 Series Resistance, Channel Length and Width, and Threshold Voltage. 4.1 Introduction. 4.2 PN Junction Diodes. 4.3 Schottky Barrier Diodes. 4.4 Solar Cells. 4.5 Bipolar Junction Transistors. 4.6 MOSFETS. 4.7 MESFETS and MODFETS. 4.8 Threshold Voltage. 4.9 Pseudo MOSFET. 4.10 Strengths and Weaknesses. Appendix 4.1 Schottky Diode Current-Voltage Equation. References. Problems. Review Questions. 5 Defects. 5.1 Introduction. 5.2 Generation-Recombination Statistics. 5.3 Capacitance Measurements. 5.4 Current Measurements. 5.5 Charge Measurements. 5.6 Deep-Level Transient Spectroscopy (DLTS). 5.7 Thermally Stimulated Capacitance and Current. 5.8 Positron Annihilation Spectroscopy (PAS). 5.9 Strengths and Weaknesses. Appendix 5.1 Activation Energy and Capture Cross-Section. Appendix 5.2 Time Constant Extraction. Appendix 5.3 Si and GaAs Data. References. Problems. Review Questions. 6 Oxide and Interface Trapped Charges, Oxide Thickness. 6.1 Introduction. 6.2 Fixed, Oxide Trapped, and Mobile Oxide Charge. 6.3 Interface Trapped Charge. 6.4 Oxide Thickness. 6.5 Strengths and Weaknesses. Appendix 6.1 Capacitance Measurement Techniques. Appendix 6.2 Effect of Chuck Capacitance and Leakage Current. References. Problems. Review Questions. 7 Carrier Lifetimes. 7.1 Introduction. 7.2 Recombination Lifetime/Surface Recombination Velocity. 7.3 Generation Lifetime/Surface Generation Velocity. 7.4 Recombination Lifetime-Optical Measurements. 7.5 Recombination Lifetime-Electrical Measurements. 7.6 Generation Lifetime-Electrical Measurements. 7.7 Strengths and Weaknesses. Appendix 7.1 Optical Excitation. Appendix 7.2 Electrical Excitation. References. Problems. Review Questions. 8 Mobility. 8.1 Introduction. 8.2 Conductivity Mobility. 8.3 Hall Effect and Mobility. 8.4 Magnetoresistance Mobility. 8.5 Time-of-Flight Drift Mobility. 8.6 MOSFET Mobility. 8.7 Contactless Mobility. 8.8 Strengths and Weaknesses. Appendix 8.1 Semiconductor Bulk Mobilities. Appendix 8.2 Semiconductor Surface Mobilities. Appendix 8.3 Effect of Channel Frequency Response. Appendix 8.4 Effect of Interface Trapped Charge. References. Problems. Review Questions. 9 Charge-based and Probe Characterization. 9.1 Introduction. 9.2 Background. 9.3 Surface Charging. 9.4 The Kelvin Probe. 9.5 Applications. 9.6 Scanning Probe Microscopy (SPM). 9.7 Strengths and Weaknesses. References. Problems. Review Questions. 10 Optical Characterization. 10.1 Introduction. 10.2 Optical Microscopy. 10.3 Ellipsometry. 10.4 Transmission. 10.5 Reflection. 10.6 Light Scattering. 10.7 Modulation Spectroscopy. 10.8 Line Width. 10.9 Photoluminescence (PL). 10.10 Raman Spectroscopy. 10.11 Strengths and Weaknesses. Appendix 10.1 Transmission Equations. Appendix 10.2 Absorption Coefficients and Refractive Indices for Selected Semiconductors. References. Problems. Review Questions. 11 Chemical and Physical Characterization. 11.1 Introduction. 11.2 Electron Beam Techniques. 11.3 Ion Beam Techniques. 11.4 X-Ray and Gamma-Ray Techniques. 11.5 Strengths and Weaknesses. Appendix 11.1 Selected Features of Some Analytical Techniques. References. Problems. Review Questions. 12 Reliability and Failure Analysis. 12.1 Introduction. 12.2 Failure Times and Acceleration Factors. 12.3 Distribution Functions. 12.4 Reliability Concerns. 12.5 Failure Analysis Characterization Techniques. 12.6 Strengths and Weaknesses. Appendix 12.1 Gate Currents. References. Problems. Review Questions. Appendix 1 List of Symbols. Appendix 2 Abbreviations and Acronyms. Index.

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Semiconductor Material and Device Characterization

This paper reviews the theory and applications of photoacoustic (also called optoacoustic) methods belonging to the more general area of photothermal measurement techniques. The theory covers excitation of gaseous or condensed samples with modulated continuous light beams or pulsed light beams. The applications of photoacoustic methods include spectroscopy, monitoring deexcitation processes, probing physical properties of materials, and generating mechanical motions. Several other related photothermal methods, as well as particle-acoustics and wave-acoustics methods are also described. This review complements an earlier and narrower review [Rev. Mod. Phys. 53, 517 (1981)] that is mainly concerned with sensitive detection by pulsed photoacoustic spectroscopy in condensed matter.

Applications of photoacoustic sensing techniques

A review of the various optical methods to detect ultrasound (bulk and surface waves) at the surface of opaque solids is presented. The most useful techniques are thoroughly analyzed. Their performance when nonideal conditions are encountered, such as vibrations, air turbulence, and rough light scattering surfaces is evaluated. This review includes a description of knife-edge techniques, optical heterodyning, differential interferometry, and velocity (time-delay) interferometry methods, plus a mention of various less-important tech-

Optical Detection of Ultrasound

This report describes the first demonstration of thermal diffusivity measurements using picosecond transient thermoreflectance (TTR). Although previously reported methods of measuring thermal transport properties of thin films require precise knowledge of the thermal properties of the substrate, this technique allows measurements on films as thin as 100 nm without any evidence of substrate interaction. The TTR measurement is modeled with a one‐dimensional heat flow equation using a two‐parameter fitting routine to determine the thermal diffusivity. The validity of our approach is confirmed by the TTR measured thermal diffusivity of single crystal nickel. We have also measured the thermal diffusivity of sputtered and evaporated single element metal films. Preliminary results from TTR measurements on compositionally modulated structures are also presented.

Transient thermoreflectance from thin metal films

Transient thermoreflectance from thin metal films (A)

We show that thermal wave detection and analysis can be performed, in a noncontact and highly sensitive manner, through the dependence of sample optical reflectance on temperature. Applications to the study of microelectronic materials are illustrated by an example of measuring the thickness of thin metal films.

Detection of thermal waves through optical reflectance

A new technique has been developed that employs highly focused laser beams for both generating and detecting thermal waves in the megahertz frequency regime. This technique includes a comprehensive 3-D depth-profiling theoretical model; it has been used to measure the thickness of both transparent and opaque thin films with high spatial resolution. Thickness sensitivities of ±2% over the 500–25,000-A range have been obtained for Al and SiO2 films on Si substrates.

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Thermal-wave detection and thin-film thickness measurements with laser beam deflection

In an ellipsometric apparatus, a laser is provided for generating a probe beam The probe beam is passed through a polarization section to give the beam a known polarization state The probe beam is then tightly focused with a high numerical aperture lens onto the surface of the sample The polarization state of the reflected probe beam is analyzed In addition, the angle of incidence of one or more rays in the incident probe beam is determined based the radial position of the rays within the reflected probe beam This approach provides enhanced spatial resolution and allows measurement over a wide spread of angles of incidence without adjusting the position of the optical components Multiple angle of incidence measurements are greatly simplified

High resolution ellipsometric apparatus

An apparatus (20) for measuring the thickness of a thin film layer (32) on substrate (28) includes a probe beam of radiation (24) focused substantially normal to the surface of the sample using a high numerical aperture lens (30). The high numerical aperture lens (30) provides a large spread of angles of incidence of the rays within the incident focused beam. A detector (50) measures the intensity across the reflected probe beam as a function of the angle of incidence with respect to the surface of the substrate (28) of various rays within the focused incident probe beam. A processor (52) functions to derive the thickness of the thin film layer based on these angular dependent intensity measurements. This result is achieved by using the angular dependent intensity measurements to solve the layer thickness using variations of the Fresnel equations. The invention is particularly suitable for measuring thin films, such as oxide layers, on silicon semiconductor samples.

Method and apparatus for measuring thickness of thin films

A new method, based on thermal wave technology, is used to monitor the ion implantation process in silicon. It is a noncontact, nondestructive technique that requires no special sample preparation or processing, has high sensitivity even at low dose, and provides a one‐micron spatial resolution capability. This method allows, for the first time, the ability to monitor the critical ion implantation process directly on the patterned product integrated circuit wafers as well as on the usual test wafers.

David L. Willenborg

Papers

Detection of thermal waves through optical reflectance

Thermal-wave detection and thin-film thickness measurements with laser beam deflection

High resolution ellipsometric apparatus

Method and apparatus for measuring thickness of thin films

Ion implant monitoring with thermal wave technology