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E. W. Lui

Researcher at RMIT University

Publications -  20
Citations -  965

E. W. Lui is an academic researcher from RMIT University. The author has contributed to research in topics: Microstructure & Alloy. The author has an hindex of 7, co-authored 18 publications receiving 508 citations. Previous affiliations of E. W. Lui include University of Melbourne.

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In situ tailoring microstructure in additively manufactured Ti-6Al-4V for superior mechanical performance

TL;DR: In this article, the lattice parameter of the β phase in the (α+β) lamellae falls into a specific range of 3.18-3.21 A. The lattice parameters can serve as an indicator to predict whether significant martensite decomposition has taken place in situ in Ti-6Al-4V made by SLM.
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Grain structure control during metal 3D printing by high-intensity ultrasound.

TL;DR: The authors combine ultrasound and 3D printing to promote equiaxed and refined microstructures in a titanium alloy and a nickel-based superalloy resulting in improved mechanical properties.
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New Development in Selective Laser Melting of Ti–6Al–4V: A Wider Processing Window for the Achievement of Fully Lamellar α + β Microstructures

TL;DR: In this paper, a fully lamellar α+β microstructures were produced in the as-built state using inter-layer times in the range of 1-12 s.
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Effects of chip conditions on the solid state recycling of Ti-6Al-4V machining chips

TL;DR: In this paper, five different types of Ti-6Al-4V machining chips were recycled in their solid state using equal channel angular pressing (ECAP), and the chips were produced by either turning or milling with or without the application of a coolant.
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Achieving Superior Strength and Ductility in Ti-6Al-4V Recycled from Machining Chips by Equal Channel Angular Pressing

TL;DR: In this paper, the times required for completely dissolving the oxide layers were calculated using models based on oxygen diffusion in α- and β-Ti, respectively, and it was shown that the oxide dissolution is rapid, taking from several minutes to less than one second at temperatures between 973 K and 1323 K (700 °C and 1050 ÂC) for thicknesses of up to 1μm.