F
Fumihiro Inoue
Researcher at Katholieke Universiteit Leuven
Publications - 91
Citations - 745
Fumihiro Inoue is an academic researcher from Katholieke Universiteit Leuven. The author has contributed to research in topics: Wafer & Layer (electronics). The author has an hindex of 12, co-authored 84 publications receiving 536 citations. Previous affiliations of Fumihiro Inoue include Tohoku University & Kansai University.
Papers
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Journal ArticleDOI
Formation of electroless barrier and seed layers in a high aspect ratio through-Si vias using Au nanoparticle catalyst for all-wet Cu filling technology
Fumihiro Inoue,Tomohiro Shimizu,Takumi Yokoyama,Hiroshi Miyake,Kazuo Kondo,Takeyasu Saito,Taro Hayashi,Shukichi Tanaka,Toshifumi Terui,Shoso Shingubara +9 more
TL;DR: In this article, an all-wet process was achieved using electroless deposition of barrier and Cu seed layers for fabrication of a high aspect ratio through-Si via (TSV).
Journal ArticleDOI
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
Fumihiro Inoue,Fumihiro Inoue,Harold Philipsen,Aleksandar Radisic,Silvia Armini,Yann Civale,Peter Leunissen,Muneharu Kondo,Eric Webb,Shoso Shingubara +9 more
TL;DR: In this paper, an electroless deposited Cu seed layer was used inside TSVs along their sidewalls, which worked as a seed layer for electrodeposition of Cu to fill the structure.
Patent
Semiconductor device and method of manufacturing the same
Keiji Emura,Fumihiro Inoue +1 more
TL;DR: In this article, the authors proposed a method to reduce diffusion of a bonding material, which is used in mounting the semiconductor device into an adhesion layer, by using an insulating layer covering from the top surface of the adhesion to the semiconducting layer.
Proceedings ArticleDOI
Hybrid 14nm FinFET - Silicon Photonics Technology for Low-Power Tb/s/mm 2 Optical I/O
Michal Rakowski,Yoojin Ban,P. De Heyn,Nicolas Pantano,Bradley Snyder,S. Balakrishnan,S. Van Huylenbroeck,L. Bogaerts,Caroline Demeurisse,Fumihiro Inoue,Kenneth June Rebibis,P. Nolmans,Xiao Sun,Pieter Bex,Ashwyn Srinivasan,J. De Coster,S. Lardenois,Andy Miller,Philippe Absil,Peter Verheyen,Dimitrios Velenis,M. Pantouvaki,J. Van Campenhout +22 more
TL;DR: In this article, a microbump flip-chip integrated 14nm-FinFET CMOS-Silicon Photonics (SiPh) technology platform enabling ultra-low power optical I/O transceivers with 1.6Tb/s/mm2 bandwidth density is demonstrated.
Journal ArticleDOI
Perfect conformal deposition of electroless Cu for high aspect ratio through-Si Vias
Fumihiro Inoue,Y. Harada,Mitsumasa Koyanagi,Takafumi Fukushima,Kazuhiro Yamamoto,S. Tanaka,Zenglin Wang,Shoso Shingubara +7 more
TL;DR: In this paper, the authors achieved perfect conformal electroless plating of Cu by the addition of Cl-and bis(3-sulfopropyl) disulfide to a standard plating bath.