The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed circuit board. The electroplating solution of the present invention is characterized by containing 50 to 300 g/L of copper sulfate, 30 to 200 g/L of sulfuric acid, 25 to 90 mg/L of chlorine ion, and 1 to 1000 mg/L of an additive comprising at least a levelling agent and a brightener.

Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board

A photosensitive film, which has a transparent support and a silver salt emulsion layer containing a silver salt formed thereon, is exposed and developed to form a metallic silver portion. The base material to be plated is electrified in an electrolytic solution free of plating substances, using the metallic silver portion as a cathode. Then, the electrified base material is subjected to an electroless plating treatment to form a first plated layer only on the metallic silver portion. The base material is subjected to an electroplating treatment to form a second plated layer on the first plated layer, further form a third plated layer on the second plated layer.

Method and apparatus for producing conductive material

In manufacturing a semiconductor device, static electricity is generated while contact holes are formed in an interlayer insulating film by dry etching. Damage to a pixel region or a driving circuit region due to travel of the static electricity generated is prevented. Gate signal lines are spaced apart from each other above a crystalline semiconductor film. Therefore a first protective circuit is not electrically connected when contact holes are opened in an interlayer insulating film. The static electricity generated during dry etching for opening the contact holes moves from the gate signal line, damages a gate insulating film, passes the crystalline semiconductor film, and again damages the gate insulating film before it reaches the gate signal line. As the static electricity generated during the dry etching damages the first protective circuit, the energy of the static electricity is reduced until it loses the capacity of damaging a driving circuit TFT. The driving circuit TFT is thus prevented from suffering electrostatic discharge damage.

Semiconductor Device and Method of Manufacturing the Same

A copper electroplating bath and a method to plate substrates with the bath are provided. The bath and method are particularly effective to plate electronic components such as semiconductive wafer VLSI and ULSI interconnects with void-free fill copper plating for circuitry forming vias and trenches and other small features less than 0.2 microns with high aspect ratios. The copper bath contains a bath soluble organic divalent sulfur compound, and a bath soluble polyether compound such as a block copolymer of polyoxyethylene and polyoxypropylene, a polyoxyethylene or polyoxypropylene derivative of a polyhydric alcohol and a mixed polyoxyethylene and polyoxypropylene derivative of a polyhydric alcohol. A preferred polyether compound is a mixed polyoxyethylene and polyoxypropylene derivative of glycerine. A preferred copper bath also contains a pyridine compound derivative.

Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect

PROBLEM TO BE SOLVED: To provide a metal-clad laminate or a resin coated metal foil, of which adhesiveness and planarity are compatible at the interface between its insulating resin composition layer and the metal foil, and practical factors concerning manufacturing of a printed board such as economical efficiency and handling properties are satisfied, and to provide the printed board which is excellent in reliability and circuit forming ability and very little in conductor loss, and its production process, using the metal-clad laminate or the resin coated foil. SOLUTION: The metal-clad laminate or the resin coated metal foil wherein the resin coated foil comprises an insulating resin composition layer and the metal foil bonded on one or both sides of it, which is characterized in that at least the insulating resin composition layer side of the metal foil is surface treated while both sides of the metal foil are substantially not subjected to roughening treatment. COPYRIGHT: (C)2004,JPO

Resin coated metal foil, metal-clad laminate, printed wiring board using the same, and its manufacturing process

PURPOSE: To improve the brightness and adhesiveness of a copper plated film in low current density distribution by adding a compound containing alcoholic hydroxide group together with a well-known brightening agent or the like into an acidic copper electroplating bath. CONSTITUTION: The electroplating is executed using a copper plating bath prepared by adding one or more kinds of the compounds selected from a polyhydric alcohol such as ethylene glycol, an alkanol sulfonic acid such as isethionic acid or its salt or an alkylene oxide such as ethylene oxide and having the alcoholic hydroxide group and the molecular weight of ≤300 so as to be 0.01-3g/l in concentration, and further by adding one or more kinds of an organic thiocompound to be conventionally used such as di-n-propyl-thioether- di-3-sulfonic acid, an oxygen containing high polymer organic compound such as polyvinyl alcohol having the molecular weight of ≤500 or an organic acid amide such as acetoamide as the brightening agent, into the copper electroplating bath containing a water soluble copper salt such as copper sulfate or an acid such as sulfuric acid. COPYRIGHT: (C)1995,JPO

Additive for copper electroplating and copper electroplating bath

PROBLEM TO BE SOLVED: To provide a removal liquid for an aluminum oxide film by which a firm oxide film can easily and securely be removed without excessively etching the surface of aluminum or an aluminum alloy, and the object to be treated in which a thin film of aluminum or an aluminum alloy is deposited on the surface can also effectively be treated. SOLUTION: The removal liquid for removing an oxide film on the surface of aluminum or an aluminum alloy contains the salt of metal replaceable with aluminum, and acid. A metal film derived from the salt of the metal contained in the removal liquid can be deposited while the removal liquid suppresses its erosion as much as possible, and the removal liquid can activate the surface of the aluminum or aluminum alloy while allowing the aluminum or aluminum alloy to securely remain even in the case the aluminum or aluminum alloy is extremely thin. COPYRIGHT: (C)2004,JPO&NCIPI

Removal liquid for aluminum oxide film, and surface treatment method for aluminum or aluminum alloy

A non-cyanide gold plating bath containing sulfurous acid or a salt thereof, which contains a quinoline compound. [Effect] The gold plating bath of the present invention has improved bath stability without affecting the properties of the deposited gold film. In this case, a gold plating film having excellent wire bonding characteristics can be obtained by not adding a mercapto group-containing compound. [Selection figure] None

Gold plating bath

PROBLEM TO BE SOLVED: To provide a method where, when an electroless nickel plating film is formed on aluminum or an aluminum alloy, and the surface of the aluminum or aluminum alloy is treated, the surface of the aluminum or aluminum alloy can be treated in such a manner that the generation of cracks in the plating is not caused, and further, the warpage of a silicon wafer is suppressed as possible. SOLUTION: An electroless nickel plating film is formed on aluminum or an aluminum alloy through a stage where an aluminum oxide film formed on the surface layer of aluminum or an aluminum alloy is removed, so as to form a first electroless nickel plating film; and a stage where a second electroless nickel plating film is formed on the surface of the first electroless nickel plating film. COPYRIGHT: (C)2008,JPO&INPIT

Surface treatment method for aluminum or aluminum alloy

PURPOSE: To obtain an electroless nickel plating solution excellent in fine pattern property by adding a compound having S-S sulfur bond into an electroless nickel plating solution containing a water-soluble nickel salt, a reducing agent and a complexing agent. CONSTITUTION: The compound having S-S sulfur bond is added into the electroless nickel plating solution containing the water-soluble nickel salt, the reducing agent and the complexing agent. As the nickel salt, nickel sulfate, nickel chloride or the like is used and the quantity to be used is preferably 0.01-1mol/l. As the reducing agent, hypophosphorous acid is preferably used by 0.01-1mol/l. As the complexing agent, malic acid or the like is preferably used by 0.01-2mol/l. As the compound having S-S sulfur bond, thiosulfat dithionate, polythionate, dithinite is preferable and the quantity to be added is suitably 0.01-100mg/l. COPYRIGHT: (C)1996,JPO

廣記内田

Papers

Additive for copper electroplating and copper electroplating bath

Removal liquid for aluminum oxide film, and surface treatment method for aluminum or aluminum alloy

Gold plating bath

Surface treatment method for aluminum or aluminum alloy

Electroless nickel plating solution and plating method

廣記 内田

Papers

Additive for copper electroplating and copper electroplating bath

Removal liquid for aluminum oxide film, and surface treatment method for aluminum or aluminum alloy

Gold plating bath

Surface treatment method for aluminum or aluminum alloy

Electroless nickel plating solution and plating method

廣記内田