K
Koichiro Shimizu
Publications - 7
Citations - 200
Koichiro Shimizu is an academic researcher. The author has contributed to research in topics: Electroless nickel plating & Plating. The author has an hindex of 3, co-authored 7 publications receiving 200 citations.
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Patent
Electroless nickel plating solution and method
Hiroki Uchida,Masayuki Kiso,Takayuki Nakamura,Tohru Kamitamari,Rumiko Hirakata Susuki,Koichiro Shimizu +5 more
TL;DR: In this article, a high-build electroless gold plating method comprising the steps of immersing a workpiece in the electroless nickel plating bath, thereby chemically depositing a nickel coating on the workpiece, and then inserting the nickel-plated workpiece into an electroless girding bath, where the gold coating was chemically deposited.
Patent
Method for plating to hard disk substrate
TL;DR: In this paper, the authors proposed an electroless nickel plating of hard disk substrates made of the glass or the ceramics, the substrates are treated with a catalyst liquid consisting essentially of a water-soluble palladium salt and an amine-base complexing agent and not containing a tin salt after the substrate is subjected to surface adjusting treatment and are then subjected to washing and drying and thereafter, the substrate are immersed into an Electroless Nickel Plating liquid and are subjected to electroless Nickel plating.
Patent
Electroless nickel plating solution and plating method
Enun Den,Masayuki Kiso,Takayuki Nakamura,Koichiro Shimizu,Hiroki Uchida,孝之 中村,燕雲 傳,廣記 内田,雅之 木曽,浩一郎 清水 +9 more
TL;DR: In this article, a compound having S-S sulfur bond is added into the electroless nickel plating solution containing the water-soluble nickel salt, the reducing agent and the complexing agent.
Patent
Electroless nickel plating bath
Hiroki Uchida,Masayuki Kiso,Takayuki Nakamura,Tohru Kamitamari,Rumiko Hirakata Susuki,Koichiro Shimizu +5 more
TL;DR: An electroless nickel plating bath comprising (a) a water-soluble Nickel salt, (b) a reducing agent, (c) a complex former and (d) a compound with a sulphur-to-sulphur bond is described in this paper.
Patent
Electroless gold plating bath and electroless gold plating method
TL;DR: In this paper, the acid amide and acid imide compd. are added into the electroless gold plating bath contg. a gold raw material and a complexing agent.