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Guangli Hu

Researcher at Corning Inc.

Publications -  50
Citations -  814

Guangli Hu is an academic researcher from Corning Inc.. The author has contributed to research in topics: Strain rate & Layer (electronics). The author has an hindex of 17, co-authored 50 publications receiving 748 citations. Previous affiliations of Guangli Hu include Johns Hopkins University.

Papers
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Compressive behavior of C/SiC composites over a wide range of strain rates and temperatures

TL;DR: In this paper, the mechanical behavior of 2D carbon fiber reinforced silicon carbide (C/SiC) composites at both quasi-static and dynamic uniaxial compression under temperatures ranging from 293 to 1273 K was investigated.
Patent

Bendable glass stack assemblies, articles and methods of making the same

TL;DR: In this article, a glass element having a thickness from 25 μm to 125 μm, a first primary surface, a second primary surface and a compressive stress region extending from the first primary to a first depth, the region defined by a compressed stress σI of at least about 100 MPa at the first surface.
Journal ArticleDOI

The Compressive Failure of Aluminum Nitride Considered as a Model Advanced Ceramic

TL;DR: In this paper, the authors used a servo hydraulic machine and a modified Kolsky bar set-up to characterize the failure of Aluminum Nitride (AlN) using high-speed digital cameras.
Journal ArticleDOI

Mechanisms of Dynamic Deformation and Dynamic Failure in Aluminum Nitride

TL;DR: In this article, the failure and deformation mechanisms of a sintered polycrystalline aluminum nitride using a servohydraulic machine and a modified Kolsky bar were investigated.
Patent

Thin glass laminate structures

TL;DR: In this paper, a laminate structure with a first glass layer, a second glass layer and at least one polymer interlayer intermediate the first and second glass layers is described. And the first glass layers are curved and the second layers are planar and cold formed onto the first.