Boosted ultraviolet electroluminescence of InGaN/AlGaN quantum structures grown on high-index contrast patterned sapphire with silica array

High-efficiency InGaN-based yellow light-emitting diodes (LEDs) with high brightness are desirable for future high-resolution displays and lighting products. Here, we demonstrate efficient InGaN-based yellow (∼570 nm) LEDs with optimized three-layer staggered quantum wells (QWs) that are grown on patterned sapphire substrates. Numerical simulations show that the electron–hole wavefunction overlap of staggered InGaN QWs with high In content exhibits a 1.7-fold improvement over that of square InGaN QWs. At the same injection current, LEDs with staggered QWs exhibit lower forward voltages and narrower full widths at half maximum than LEDs with square QWs. The light output power and external quantum efficiency of a staggered QW LED are 10.2 mW and 30.8%, respectively, at 15 mA. We combine atomic probe tomography (APT), time-resolved photoluminescence (TRPL), and transmission electron microscopy (TEM) with energy-dispersive x-ray (EDX) mapping spectroscopy to shed light on the origin of enhanced device performance. APT results confirm the staggered In profile of our designed staggered QWs structure, and TRPL results reveal decreased defect-state carrier trapping in staggered QWs. Furthermore, TEM with EDX mapping spectroscopy supports the viewpoint that staggered QWs exhibit uniform elemental distribution and improved crystal quality. Together, these factors above contribute to enhanced LED performance. Our study shows that staggered InGaN QWs provide a promising strategy for the development of LEDs that are efficient in the long-wavelength region.

Rational construction of staggered InGaN quantum wells for efficient yellow light-emitting diodes

The disinfection industry would greatly benefit from efficient, robust, high-power deep-ultraviolet light-emitting diodes (UV–C LEDs). However, the performance of UV–C AlGaN LEDs is limited by poor...

AlGaN deep-ultraviolet light-emitting diodes grown on SiC substrates

Growth of high-quality AlN films on sapphire substrate by introducing voids through growth-mode modification

Motor abnormalities in first-episode psychosis patients and long-term psychosocial functioning.

High-power flip-chip light-emitting diodes (FCLEDs) suffer from low efficiencies because of poor p-type reflective ohmic contact and severe current crowding. Here, we show that it is possible to improve both the light extraction efficiency (LEE) and current spreading of an FCLED by incorporating a highly reflective metallic reflector made from silver (Ag). The reflector, which consists of an Ag film covered by three pairs of TiW/Pt multilayers, demonstrates high reflectance of 95.0% at 460 nm at arbitrary angles of incidence. Our numerical simulation and experimental results reveal that the FCLED with Ag-based reflector exhibits higher LEE and better current spreading than the FCLED with indium-tin oxide (ITO)/distributed Bragg reflector (DBR). As a result, the external quantum efficiency (EQE) of FCLED with Ag-based reflector was 6.0% higher than that of FCLED with ITO/DBR at 750 mA injection current. Our work also suggests that the EQE of FCLED with the Ag-based reflector could be further enhanced 5.2% by replacing the finger-like n-electrodes with three-dimensional (3D) vias n-electrodes, which spread the injection current uniformly over the entire light-emitting active region. This study paves the way towards higher-performance LED technology.

Highly efficient GaN-based high-power flip-chip light-emitting diodes

The development of efficient green light-emitting diodes (LEDs) is of paramount importance for the realization of colour-mixing white LEDs with a high luminous efficiency. While the insertion of an InGaN/GaN superlattice (SL) with a lower In content before the growth of InGaN/GaN multiple quantum wells (MQWs) is known to increase the efficiency of LEDs, the actual mechanism is still debated. We therefore conduct a systematic study and investigate the different mechanisms for this system. Through cathodoluminescence and Raman measurements, we clearly demonstrate that the potential barrier formed by the V-pit during the low-temperature growth of an InGaN/GaN SL dramatically increases the internal quantum efficiency (IQE) of InGaN quantum wells (QWs) by suppressing non-radiative recombination at threading dislocations (TDs). We find that the V-pit potential barrier height depends on the V-pit diameter, which plays an important role in determining the quantum efficiency, forward voltage and efficiency droop of green LEDs. Furthermore, our study reveals that the low-temperature GaN can act as an alternative to an InGaN/GaN SL structure for promoting the formation of V-pits. Our findings suggest the potential of implementing optimized V-pits embedded in an InGaN/GaN SL or low-temperature GaN structure as a beneficial underlying layer for the realization of highly efficient green LEDs.

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Han Yan

Papers

Highly efficient GaN-based high-power flip-chip light-emitting diodes

The effect of nanometre-scale V-pits on electronic and optical properties and efficiency droop of GaN-based green light-emitting diodes.